HD6473258P10 Renesas Electronics America, HD6473258P10 Datasheet - Page 222

IC H8 MCU OTP 32K 64DIP

HD6473258P10

Manufacturer Part Number
HD6473258P10
Description
IC H8 MCU OTP 32K 64DIP
Manufacturer
Renesas Electronics America
Series
H8® H8/325r
Datasheet

Specifications of HD6473258P10

Core Processor
H8/300
Core Size
8-Bit
Speed
10MHz
Connectivity
SCI, UART/USART
Number Of I /o
53
Program Memory Size
32KB (32K x 8)
Program Memory Type
OTP
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
64-DIP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Data Converters
-
Peripherals
-

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(2) Handling after Programming: Fluorescent light and sunlight contain small amounts of
ultraviolet, so prolonged exposure to these types of light can cause programmed data to invert. In
addition, exposure to any type of intense light can induce photoelectric effects that may lead to chip
malfunction. It is recommended that after programming the chip, you cover the erasing window
with a light-proof label (such as an ultraviolet-shield label).
Be careful when using cooling sprays, since they may have a slight ion content.
Cover the window with an ultraviolet-shield label, preferably a label including a conductive
material. Besides protecting the PROM contents from ultraviolet light, the label protects the
chip by distributing static charge uniformly.
217

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