HD6473258P10 Renesas Electronics America, HD6473258P10 Datasheet - Page 248

IC H8 MCU OTP 32K 64DIP

HD6473258P10

Manufacturer Part Number
HD6473258P10
Description
IC H8 MCU OTP 32K 64DIP
Manufacturer
Renesas Electronics America
Series
H8® H8/325r
Datasheet

Specifications of HD6473258P10

Core Processor
H8/300
Core Size
8-Bit
Speed
10MHz
Connectivity
SCI, UART/USART
Number Of I /o
53
Program Memory Size
32KB (32K x 8)
Program Memory Type
OTP
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
64-DIP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Data Converters
-
Peripherals
-

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Table 15-8. Timing Conditions of On-Chip Supporting Modules (cont.)
Condition A: V
Condition B: V
Item
Parallel
handshake input strobe
interface
• Measurement Conditions for AC Characteristics
Handshake
pulse width
Handshake
input data
setup time
Handshake
input data
hold time
Handshake
output strobe t
delay time
Busy output
delay time
LSI
output pin
Input/output timing reference levels
Ta = –20 to 75˚C (regular specifications), Ta = –40 to 85˚C (wide-range specifications)
CC
CC
Low:
High:
= 5.0V ±10%, Ø = 0.5 to 10MHz, V
= 2.7 to 3.6V, V
0.8 V
2.0 V
Symbol min
t
t
t
t
t
t
HISW
HIS
HIH
HOSD1
HOSD2
HBSOD1
HBSOD2
C
Condition B
5MHz
1.5
10
120
Figure 15-3. Output Load Circuit
SS
max
100
100
150
150
R
= 0V, Ta = –20 to 75˚C, for only H8/3257 and H8/3256
H
6MHz
min
1.5
10
120
245
80
80
150
150
max
5 V
R
L
SS
Condition A
8MHz
min
1.5
10
120
= 0V,
C =
R
R
L
H
=
=
max
80
80
150
150
90 pF: Ports 1, 2, 3, 4
30 pF: Ports 4 (except 4
2.4 kΩ
12 kΩ
10MHz
min
1.5
10
120
max
80
80
150
150
6
Unit
t
ns
ns
ns
ns
ns
ns
, 6, 7
cyc
6
), 5
Measurement
conditions
Fig. 15-19
Fig. 15-19
Fig. 15-19
Fig. 15-20
Fig. 15-20
Fig. 15-21
Fig. 15-21

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