HD6473258P10 Renesas Electronics America, HD6473258P10 Datasheet - Page 261

• Manufacturer Part Number: HD6473258P10
• Description: IC H8 MCU OTP 32K 64DIP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/325r

Specifications of HD6473258P10

• Core Processor: H8/300
• Core Size: 8-Bit
• Speed: 10MHz
• Connectivity: SCI, UART/USART
• Number Of I /o: 53
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: OTP
• Ram Size: 1K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Oscillator Type: External
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 64-DIP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Data Converters: -
• Peripherals: -

Table A-2. Operation Code Map
*
*
1
2
HI
The MOVFPE and MOVTPE instructions are identical to MOV instructions in the first byte and first bit of the second byte (bits 15 to 7 of the instruction word). The PUSH and POP
instructions are identical in machine language to MOV instructions.
The BT, BF, BHS, and BLO instructions are identical in machine language to BRA, BRN, BCC, and BCS, respectively.
0
1
2
5
6
7
8
9
A
B
C
D
E
3
4
F
LO
SHLL
MULXU
BRA
BSET
NOP
0
SHAL
*2
SHLR
BRN
DIVXU
SLEEP
BNOT
1
SHAR
*2
ROTXL
BCLR
BHI
STC
2
ROTL
ROTXR
BTST
LDC
BLS
3
ROTR
BOR
BCC
ORC
OR
RTS
4
BIOR
*2
BXOR
BCS
XORC
BSR
XOR
5
BIXOR
*2
BAND
ANDC
BNE
RTE
AND
BIAND
6
BST
NOT
BLD
LDC
BEQ
7
BILD
BIST
NEG
MOV
ADDX
SUBX
ADD
CMP
XOR
MOV
AND
OR
BVC
8
ADD
SUB
MOV
BVS
9
DEC
BPL
INC
JMP
A
EEPMOV
ADDS
SUBS
BMI
B
MOV
BGE
*1
C
MOV
CMP
Bit manipulation instruction
BLT
D
ADDX
SUBX
BGT
JSR
E
DAA
DAS
BLE
F