HD6473258P10 Renesas Electronics America, HD6473258P10 Datasheet - Page 242

IC H8 MCU OTP 32K 64DIP

HD6473258P10

Manufacturer Part Number
HD6473258P10
Description
IC H8 MCU OTP 32K 64DIP
Manufacturer
Renesas Electronics America
Series
H8® H8/325r
Datasheet

Specifications of HD6473258P10

Core Processor
H8/300
Core Size
8-Bit
Speed
10MHz
Connectivity
SCI, UART/USART
Number Of I /o
53
Program Memory Size
32KB (32K x 8)
Program Memory Type
OTP
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
64-DIP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Data Converters
-
Peripherals
-

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Table 15-3. DC Characteristics (3V Version for only H8/3257 and H8/3256) (cont.)
Conditions: V
Item
Input capacitance RES
Current
dissipation*
RAM standby
voltage
Note: Current dissipation values assume that V
are in the no-load state, and all MOS input pull-ups are off.
CC
= 2.7 to 3.6V, V
NMI
All input pins
except RES
and NMI
Normal
operation
Sleep mode
Normal
operation
Sleep mode
Standby modes
SS
= 0V, Ta = –20 to 75˚C
Symbol
C
I
V
CC
in
RAM
IH min.
239
min
2.0
= V
CC
typ
4
3
6
4
0.01
– 0.5V, V
max
60
30
15
12
8
5.0
IL max.
Unit
pF
pF
pF
mA
mA
mA
mA
µA
V
= 0.5V, all output pins
Measurement
conditions
V
f = 1 MHz
Ta = 25˚C
f = 3 MHz
f = 5 MHz
in
= 0 V

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