HD6473258P10 Renesas Electronics America, HD6473258P10 Datasheet - Page 224

• Manufacturer Part Number: HD6473258P10
• Description: IC H8 MCU OTP 32K 64DIP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/325r

Specifications of HD6473258P10

• Core Processor: H8/300
• Core Size: 8-Bit
• Speed: 10MHz
• Connectivity: SCI, UART/USART
• Number Of I /o: 53
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: OTP
• Ram Size: 1K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Oscillator Type: External
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 64-DIP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Data Converters: -
• Peripherals: -

12.2 System Control Register: Power-Down Control Bits
Bits 7 to 4 of the system control register (SYSCR) concern the power-down state. Specifically,
they concern the software standby mode.
Table 12-2 lists the attributes of the system control register.
Table 12-2. System Control Register
Name
System control register
Bit
Initial value
Read/Write
Bit 7 – Software Standby (SSBY): This bit enables or disables the transition to the software
standby mode.
On recovery from the software standby mode by an external interrupt or input strobe interrupt,
SSBY remains set to 1. To clear this bit, software must write a 0.
Bit 7
SSBY
Bits 6 to 4 – Standby Timer Select 2 to 0 (STS2 to STS0): These bits select the clock settling
time when the chip recovers from the software standby mode by an external interrupt. During the
selected time, the clock oscillator runs but clock pulses are not supplied to the CPU or the on-chip
supporting modules.
0
1
Description
The SLEEP instruction causes a transition to the sleep mode.
The SLEEP instruction causes a transition to the software
standby mode.
SSBY
R/W
7
0
STS2
R/W
Abbreviation
SYSCR
6
0
STS1
R/W
5
0
R/W
R/W
STS0
220
R/W
4
0
Initial value Address
H’0B
—
—
3
1
NMIEG
R/W
2
0
H’FFC4
—
—
1
1
(Initial value)
RAME
R/W
0
1