HD6473258P10 Renesas Electronics America, HD6473258P10 Datasheet - Page 128

IC H8 MCU OTP 32K 64DIP

HD6473258P10

Manufacturer Part Number
HD6473258P10
Description
IC H8 MCU OTP 32K 64DIP
Manufacturer
Renesas Electronics America
Series
H8® H8/325r
Datasheet

Specifications of HD6473258P10

Core Processor
H8/300
Core Size
8-Bit
Speed
10MHz
Connectivity
SCI, UART/USART
Number Of I /o
53
Program Memory Size
32KB (32K x 8)
Program Memory Type
OTP
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
64-DIP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Data Converters
-
Peripherals
-

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6.3.2 Busy Signal Output Timing
The busy signal remains low from the fall of the input strobe signal until the data latched in port 3
have been read, unlocking the latch. Figure 6-4 shows an example.
While the busy signal is low, data input to port 3 are not latched, even if the input strobe signal goes
low again.
6.3.3 Operation in Software Standby Mode
In software standby mode, the OS and BUSY output pins retain their previous states.
For timing of the output strobe signal, the entire time during when the chip is in software standby
mode is counted as zero system clock cycles. Figure 6-5 shows an example.
Port 3
Ø
OS
Ø
BUSY
IS
Port 3 write
(Consecutive Writing of Port 3 When OSS = 1)
Figure 6-3. Output Strobe Output Timing
Figure 6-4. Busy Signal Output Timing
Port 3 write
119
Port 3 read
Not output
Fig 6-3

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