HD6473258P10 Renesas Electronics America, HD6473258P10 Datasheet - Page 247

IC H8 MCU OTP 32K 64DIP

HD6473258P10

Manufacturer Part Number
HD6473258P10
Description
IC H8 MCU OTP 32K 64DIP
Manufacturer
Renesas Electronics America
Series
H8® H8/325r
Datasheet

Specifications of HD6473258P10

Core Processor
H8/300
Core Size
8-Bit
Speed
10MHz
Connectivity
SCI, UART/USART
Number Of I /o
53
Program Memory Size
32KB (32K x 8)
Program Memory Type
OTP
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
64-DIP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Data Converters
-
Peripherals
-

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Table 15-8. Timing Conditions of On-Chip Supporting Modules (cont.)
Condition A: V
Condition B: V
Item
TMR
SCI
Ports
Timer output
delay time
Timer reset
input setup time
Timer clock
input setup time
Timer clock
pulse width
(single edge)
Timer clock
pulse width
(both edges)
Input (Async)
clock (Sync)
cycle
Transmit data
delay time (Sync)
Receive data
setup time (Sync)
Receive data
hold time (Sync)
Input clock
pulse width
Output data
delay time
Input data setup
time
Input data hold
time
Ta = –20 to 75˚C (regular specifications), Ta = –40 to 85˚C (wide-range specifications)
CC
CC
= 5.0V ±10%, Ø = 0.5 to 10MHz, V
= 2.7 to 3.6V, V
Symbol min
t
t
t
t
t
t
t
t
t
t
t
t
t
t
TMOD
TMRS
TMCS
TMCWH
TMCWL
Scyc
Scyc
TXD
RXS
RXH
SCKW
PWD
PRS
PRH
Condition B
5MHz
80
80
1.5
2.5
2
4
150
150
0.4
80
80
SS
max
150
200
0.6
150
= 0V, Ta = –20 to 75˚C, for only H8/3257 and H8/3256
6MHz
min
50
50
1.5
2.5
2
4
100
100
0.4
50
50
244
max
100
100
0.6
100
SS
Condition A
8MHz
min
50
50
1.5
2.5
2
4
100
100
0.4
50
50
= 0V,
max
100
100
0.6
100
10MHz
min
50
50
1.5
2.5
2
4
100
100
0.4
50
50
max
100
100
0.6
100
Unit
ns
ns
ns
t
t
t
t
ns
ns
ns
t
ns
ns
ns
cyc
cyc
cyc
cyc
Scyc
Measurement
conditions
Fig. 15-13
Fig. 15-15
Fig. 15-14
Fig. 15-14
Fig. 15-14
Fig. 15-16
Fig. 15-16
Fig. 15-16
Fig. 15-16
Fig. 15-16
Fig. 15-17
Fig. 15-18
Fig. 15-18
Fig. 15-18

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