HD6473258P10 Renesas Electronics America, HD6473258P10 Datasheet - Page 265

IC H8 MCU OTP 32K 64DIP

HD6473258P10

Manufacturer Part Number
HD6473258P10
Description
IC H8 MCU OTP 32K 64DIP
Manufacturer
Renesas Electronics America
Series
H8® H8/325r
Datasheet

Specifications of HD6473258P10

Core Processor
H8/300
Core Size
8-Bit
Speed
10MHz
Connectivity
SCI, UART/USART
Number Of I /o
53
Program Memory Size
32KB (32K x 8)
Program Memory Type
OTP
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
64-DIP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Data Converters
-
Peripherals
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD6473258P10
Manufacturer:
EXEL
Quantity:
6 218
Part Number:
HD6473258P10
Manufacturer:
HIT
Quantity:
1 000
Part Number:
HD6473258P10
Manufacturer:
RENESAS
Quantity:
1 000
Part Number:
HD6473258P10V
Manufacturer:
RENESAS
Quantity:
600
Part Number:
HD6473258P10V
Manufacturer:
RENESAS
Quantity:
1 200
Part Number:
HD6473258P10V
Manufacturer:
HITACHI/日立
Quantity:
20 000
Table A-4. Number of Cycles in Each Instruction (cont.)
Instruction Mnemonic
BSR
BST
BTST
BXOR
CMP
DAA
DAS
DEC
DIVXU
EEPMOV
INC
JMP
JSR
LDC
MOV
Note: Blank entries are all zero.
BSR d:8
BST #xx:3, Rd
BST #xx:3, @Rd
BST #xx:3, @aa:8
BTST #xx:3, Rd
BTST #xx:3, @Rd
BTST #xx:3, @aa:8
BTST Rn, Rd
BTST Rn, @Rd
BTST Rn, @aa:8
BXOR #xx:3, Rd
BXOR #xx:3, @Rd
BXOR #xx:3, @aa:8
CMP.B #xx:8, Rd
CMP.B Rs, Rd
CMP.W Rs, Rd
DAA.B Rd
DAS.B Rd
DEC.B Rd
DIVXU.B Rs, Rd
EEPMOV
INC.B Rd
JMP @Rn
JMP @aa:16
JMP @@aa:8
JSR @Rn
JSR @aa:16
JSR @@aa:8
LDC #xx:8, CCR
LDC Rs, CCR
MOV.B #xx:8, Rd
MOV.B Rs, Rd
MOV.B @Rs, Rd
MOV.B @(d:16,Rs), Rd
Instruction Branch
fetch
I
2
1
2
2
1
2
2
1
2
2
1
2
2
1
1
1
1
1
1
1
2
1
2
2
2
2
2
2
1
1
1
1
1
2
addr. read
J
1
1
269
1
1
Stack
operation
K
1
1
Byte data Word data Internal
access
L
2
2
1
1
1
1
1
1
2n+2
1
1
*1
access
M
operation
N
6
1
1
1

Related parts for HD6473258P10