HD6473258P10 Renesas Electronics America, HD6473258P10 Datasheet - Page 240

IC H8 MCU OTP 32K 64DIP

HD6473258P10

Manufacturer Part Number
HD6473258P10
Description
IC H8 MCU OTP 32K 64DIP
Manufacturer
Renesas Electronics America
Series
H8® H8/325r
Datasheet

Specifications of HD6473258P10

Core Processor
H8/300
Core Size
8-Bit
Speed
10MHz
Connectivity
SCI, UART/USART
Number Of I /o
53
Program Memory Size
32KB (32K x 8)
Program Memory Type
OTP
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
64-DIP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Data Converters
-
Peripherals
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD6473258P10
Manufacturer:
EXEL
Quantity:
6 218
Part Number:
HD6473258P10
Manufacturer:
HIT
Quantity:
1 000
Part Number:
HD6473258P10
Manufacturer:
RENESAS
Quantity:
1 000
Part Number:
HD6473258P10V
Manufacturer:
RENESAS
Quantity:
600
Part Number:
HD6473258P10V
Manufacturer:
RENESAS
Quantity:
1 200
Part Number:
HD6473258P10V
Manufacturer:
HITACHI/日立
Quantity:
20 000
Table 15-2. DC Characteristics (5V Version) (cont.)
Conditions: V
Item
Input capacitance RES
Current
dissipation
RAM standby
voltage
Notes: 1. Current dissipation values assume that V
2. For these values it is assumed that V
pins are in the no-load state, and all MOS input pull-ups are off.
V
*1
IL
CC
max = 0.3 V.
= AV
NMI
All input pins
except RES
and NMI
Normal
operation
Sleep mode
Standby modes
CC
= 5.0V ±10%, V
*2
Symbol
C
I
V
CC
in
RAM
SS
= 0V, Ta = –20 to 75˚C (regular specifications)
RAM
237
min
2.0
Ta = –40 to 85˚C (wide-range specifications)
IH min.
≤ V
CC
= V
< 4.5 V and V
typ
12
16
20
8
10
12
0.01
CC
– 0.5V, V
max
60
30
15
25
30
40
15
20
25
5.0
IH
IL max.
min = V
Unit
pF
pF
pF
mA
mA
mA
mA
mA
mA
µA
V
= 0.5V, all output
CC
Measurement
conditions
V
f = 1 MHz
Ta = 25˚C
f = 6 MHz
f = 8 MHz
f = 10 MHz
f = 6 MHz
f = 8 MHz
f = 10 MHz
in
= 0 V
0.9,

Related parts for HD6473258P10