HD6473258P10 Renesas Electronics America, HD6473258P10 Datasheet - Page 228

IC H8 MCU OTP 32K 64DIP

HD6473258P10

Manufacturer Part Number
HD6473258P10
Description
IC H8 MCU OTP 32K 64DIP
Manufacturer
Renesas Electronics America
Series
H8® H8/325r
Datasheet

Specifications of HD6473258P10

Core Processor
H8/300
Core Size
8-Bit
Speed
10MHz
Connectivity
SCI, UART/USART
Number Of I /o
53
Program Memory Size
32KB (32K x 8)
Program Memory Type
OTP
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
64-DIP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Data Converters
-
Peripherals
-

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The NMI edge bit (NMIEG) in the system control register is originally cleared to 0, selecting the
falling edge. When NMI goes low, the NMI interrupt handling routine sets NMIEG to 1 (selecting
the rising edge), sets SSBY to 1, then executes the SLEEP instruction. The chip enters the software
standby mode. It recovers from the software standby mode on the next rising edge of NMI.
12.4.4 Notes on Current Dissipation
1. The I/O ports remain in their current states in software standby mode. If a port is in the high
2. When software standby mode is entered under condition (a) or (b) below, current dissipation is
output state, it continues to dissipate power in proportion to the output current.
higher (I
(a) In single-chip mode (mode 3): when software standby mode is entered by executing an
Clock
generator
NMI
NMIEG
SSBY
Ø
instruction stored in on-chip ROM, after even one instruction not stored in on-chip ROM
has been fetched (e.g. from on-chip RAM).
CC
= 100 to 300 µA) than normal in standby mode.
Figure 12-1. Software Standby Mode NMI Timing (Example)
NMI interrupt handler
NMIEG = 1
SSBY = 1
Software standby mode
SLEEP
(power-down state)
224
Settling time
Fig 12-1
NMI interrupt handler

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