DF2166VT33WV Renesas Electronics America, DF2166VT33WV Datasheet - Page 25

• Manufacturer Part Number: DF2166VT33WV
• Description: MCU 16BIT FLASH 3V 512K 144-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2100r

Specifications of DF2166VT33WV

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 33MHz
• Connectivity: I²C, IrDA, LPC, SCI, SmartCard
• Peripherals: POR, PWM, WDT
• Number Of I /o: 106
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 40K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: External
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 144-TQFP, 144-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

23.2 Mode Transitions and LSI States ...................................................................................... 735
23.3 Medium-Speed Mode........................................................................................................ 739
23.4 Sleep Mode ....................................................................................................................... 740
23.5 Software Standby Mode.................................................................................................... 741
23.6 Hardware Standby Mode .................................................................................................. 743
23.7 Watch Mode...................................................................................................................... 744
23.8 Subsleep Mode.................................................................................................................. 745
23.9 Subactive Mode ................................................................................................................ 746
23.10 Module Stop Mode ........................................................................................................... 747
23.11 Direct Transitions.............................................................................................................. 747
23.12 Usage Notes ...................................................................................................................... 748
Section 24 List of Registers ...............................................................................749
24.1 Register Addresses (Address Order)................................................................................. 749
24.2 Register Bits...................................................................................................................... 762
24.3 Register States in Each Operating Mode .......................................................................... 773
Section 25 Electrical Characteristics .................................................................783
25.1 Absolute Maximum Ratings ............................................................................................. 783
25.2 DC Characteristics ............................................................................................................ 784
25.3 AC Characteristics ............................................................................................................ 788
25.4 A/D Conversion Characteristics........................................................................................ 811
25.5 D/A Conversion Characteristics........................................................................................ 812
25.6 Flash Memory Characteristics .......................................................................................... 813
25.7 Usage Notes ...................................................................................................................... 816
23.1.3 Module Stop Control Registers H, L, and A
23.1.4 Sub-Chip Module Stop Control Registers BH, BL
23.1.5 Sub-Chip Module Stop Control Registers AH, AL
23.12.1 I/O Port Status...................................................................................................... 748
23.12.2 Current Consumption when Waiting for Oscillation Settling .............................. 748
23.12.3 DTC Module Stop Mode ..................................................................................... 748
23.12.4 Notes on Subclock Usage .................................................................................... 748
25.3.1 Clock Timing ....................................................................................................... 788
25.3.2 Control Signal Timing ......................................................................................... 792
25.3.3 Bus Timing .......................................................................................................... 794
25.3.4 Multiplex Bus Timing.......................................................................................... 800
25.3.5 Timing of On-Chip Peripheral Modules .............................................................. 802
(MSTPCRH, MSTPCRL, MSTPCRA) ............................................................... 732
(SUBMSTPBH, SUBMSTPBL) ......................................................................... 734
(SUBMSTPAH, SUBMSTPAL) ......................................................................... 734
Rev. 3.00, 03/04, page xxiii of xl