DF2166VT33WV Renesas Electronics America, DF2166VT33WV Datasheet - Page 214

• Manufacturer Part Number: DF2166VT33WV
• Description: MCU 16BIT FLASH 3V 512K 144-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2100r

Specifications of DF2166VT33WV

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 33MHz
• Connectivity: I²C, IrDA, LPC, SCI, SmartCard
• Peripherals: POR, PWM, WDT
• Number Of I /o: 106
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 40K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: External
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 144-TQFP, 144-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Table 7.9
The number of execution states is calculated from using the formula below. Note that Σ is the sum
of all transfers activated by one activation source (the number in which the CHNE bit is set to 1,
plus 1).
Number of execution states = I · S
For example, when the DTC vector address table is located in on-chip ROM, normal mode is set,
and data is transferred from on-chip ROM to an internal I/O register, then the time required for the
DTC operation is 13 states. The time from activation to the end of data write is 10 states.
Rev. 3.00, 03/04, page 172 of 830
Object to be Accessed
Bus width
Access states
Execution
status
Vector read
Register
information
read/write
Byte data read S
Word data read
Byte data write S
Word data write
Internal operation
Number of States Required for Each Execution Status
S
S
S
S
S
M
K
K
J
L
L
I
On-Chip RAM
(H'FFEC00 to
H'FFEFFF)
32
1
—
1
1
1
1
1
1
I
+ Σ (J · S
On-Chip RAM
(On-chip RAM area
other than H'FFEC00 to
H'FFEFFF)
16
1
—
—
1
1
1
1
1
J
+ K · S
K
+ L · S
On-
Chip
ROM
16
1
1
—
1
1
1
1
1
L
) + M · S
On-Chip
I/O
Registers
8
2
—
—
2
4
2
4
1
16
2
—
—
2
2
2
2
1
M
External Devices
8
2
4
—
2
4
2
4
1
8
3
6 + 2m
—
3 + m
6 + 2m
3 + m
6 + 2m
1
16
2
2
—
2
2
2
2
1
16
3
3 + m
—
3 + m
3 + m
3 + m
3 + m
1