AT91SAM9263B-CU Atmel, AT91SAM9263B-CU Datasheet - Page 242

• Manufacturer Part Number: AT91SAM9263B-CU
• Description: IC ARM9 MCU 200 MHZ 324-TFBGA
• Manufacturer: Atmel
• Series: AT91SAMr

Specifications of AT91SAM9263B-CU

• Core Processor: ARM9
• Core Size: 16/32-Bit
• Speed: 240MHz
• Connectivity: CAN, Ethernet, I²C, MMC, SPI, SSC, UART/USART, USB
• Peripherals: AC'97, LCD, POR, PWM, WDT
• Number Of I /o: 160
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: ROM
• Ram Size: 128K x 8
• Voltage - Supply (vcc/vdd): 1.08 V ~ 1.32 V
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 324-TFBGA
• Processor Series: AT91SAMx
• Core: ARM926EJ-S
• Data Bus Width: 32 bit
• Data Ram Size: 96 KB
• Interface Type: 2-Wire, EBI, I2S, MCI, SPI, USART
• Maximum Clock Frequency: 200 MHz
• Number Of Programmable I/os: 160
• Number Of Timers: 4
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: JTRACE-ARM-2M, MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: AT91SAM-ICE, AT91-ISP, AT91SAM9263-EK
• Minimum Operating Temperature: - 40 C
• Package: 324TFBGA
• Device Core: ARM926EJ-S
• Family Name: 91S
• Maximum Speed: 200 MHz
• Operating Supply Voltage: 1.8|2.5|3.3 V
• Controller Family/series: AT91SAM9xxx
• No. Of I/o's: 160
• Ram Memory Size: 96KB
• Cpu Speed: 240MHz
• No. Of Timers: 1
• Rohs Compliant: Yes
• For Use With: AT91SAM9263-EK - KIT EVAL FOR AT91SAM9263AT91SAM-ICE - EMULATOR FOR AT91 ARM7/ARM9
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: Q3735625

23.5.5
23.5.5.1
6249H–ATARM–27-Jul-09
Power Management
Self-refresh Mode
Three low-power modes are available:
The SDRAM Controller activates one low-power mode as soon as the SDRAM device is not
selected. It is possible to delay the entry in self-refresh and power-down mode after the last
access by programming a timeout value in the Low Power Register.
This mode is selected by programming the LPCB field to 1 in the SDRAMC Low Power Register.
In self-refresh mode, the SDRAM device retains data without external clocking and provides its
own internal clocking, thus performing its own auto-refresh cycles. All the inputs to the SDRAM
device become “don’t care” except SDCKE, which remains low. As soon as the SDRAM device
is selected, the SDRAM Controller provides a sequence of commands and exits self-refresh
mode.
Some low-power SDRAMs (e.g., mobile SDRAM) can refresh only one quarter or a half quarter
or all banks of the SDRAM array. This feature reduces the self-refresh current. To configure this
feature, Temperature Compensated Self Refresh (TCSR), Partial Array Self Refresh (PASR)
and Drive Strength (DS) parameters must be set in the Low Power Register and transmitted to
the low-power SDRAM during initialization.
The SDRAM device must remain in self-refresh mode for a minimum period of t
remain in self-refresh mode for an indefinite period. This is described in
• Self-refresh Mode: The SDRAM executes its own Auto-refresh cycle without control of the
• Power-down Mode: Auto-refresh cycles are controlled by the SDRAM Controller. Between
• Deep Power-down Mode: (Only available with Mobile SDRAM) The SDRAM contents are
SDRAM Controller. Current drained by the SDRAM is very low.
auto-refresh cycles, the SDRAM is in power-down. Current drained in Power-down mode is
higher than in Self-refresh Mode.
lost, but the SDRAM does not drain any current.
AT91SAM9263
Figure
23-6.
RAS
and may
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