AT91SAM9263B-CU Atmel, AT91SAM9263B-CU Datasheet - Page 1079
AT91SAM9263B-CU
Manufacturer Part Number
AT91SAM9263B-CU
Description
IC ARM9 MCU 200 MHZ 324-TFBGA
Manufacturer
Atmel
Series
AT91SAMr
Specifications of AT91SAM9263B-CU
Core Processor
ARM9
Core Size
16/32-Bit
Speed
240MHz
Connectivity
CAN, Ethernet, I²C, MMC, SPI, SSC, UART/USART, USB
Peripherals
AC'97, LCD, POR, PWM, WDT
Number Of I /o
160
Program Memory Size
128KB (128K x 8)
Program Memory Type
ROM
Ram Size
128K x 8
Voltage - Supply (vcc/vdd)
1.08 V ~ 1.32 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
324-TFBGA
Processor Series
AT91SAMx
Core
ARM926EJ-S
Data Bus Width
32 bit
Data Ram Size
96 KB
Interface Type
2-Wire, EBI, I2S, MCI, SPI, USART
Maximum Clock Frequency
200 MHz
Number Of Programmable I/os
160
Number Of Timers
4
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
JTRACE-ARM-2M, MDK-ARM, RL-ARM, ULINK2
Development Tools By Supplier
AT91SAM-ICE, AT91-ISP, AT91SAM9263-EK
Minimum Operating Temperature
- 40 C
Package
324TFBGA
Device Core
ARM926EJ-S
Family Name
91S
Maximum Speed
200 MHz
Operating Supply Voltage
1.8|2.5|3.3 V
Controller Family/series
AT91SAM9xxx
No. Of I/o's
160
Ram Memory Size
96KB
Cpu Speed
240MHz
No. Of Timers
1
Rohs Compliant
Yes
For Use With
AT91SAM9263-EK - KIT EVAL FOR AT91SAM9263AT91SAM-ICE - EMULATOR FOR AT91 ARM7/ARM9
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Data Converters
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
Q3735625
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
AT91SAM9263B-CU
Manufacturer:
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Quantity:
1 043
Part Number:
AT91SAM9263B-CU
Manufacturer:
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Company:
Part Number:
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50.3.12
50.3.12.1
50.3.13
50.3.13.1
6249H–ATARM–27-Jul-09
SDRAM Controller
Static Memory Controller (SMC)
Mobile SDRAM Device Initialization Constraint
SMC Chip Select Parameters Modification
Using Mobile SDRAM devices that need to have their DQMx level HIGH during Mobile SDRAM
device initialization may lead to data bus contention and thus external memories on the same
EBI must not be accessed.
This does not apply to Mobile SDRAM devices whose DQMx level is “Don’t care” during this
phase.
Mobile SDRAM initialization must be performed in internal SRAM.
The user must not change the configuration parameters of an SMC Chip Select (Setup, Pulse,
Cycle, Mode) if accesses are performed on this CS during the modification.
For example, the modification of the Chip Select 0 (CS0) parameters while fetching the code
from a memory on CS0, may lead to unpredictable behavior.
soft_user_reset
;disable IRQs
;change refresh rate to block all data accesses
;prepare power down command
;prepare proc_reset and periph_reset
;perform power down command
;perform proc_reset and periph_reset (in the ARM pipeline)
Problem Fix/Workaround
INCLUDEAT91SAM9xxx.inc
EXPORTsoft_user_reset
MRS r0, CPSR
ORR r0, r0, #0x80
MSR CPSR_c, r0
LDR r0, =AT91C_SDRAMC_TR
LDR r1, =1
STR r1, [r0]
LDR r0, =AT91C_SDRAMC_LPR
LDR r1, =2
LDR r2, =AT91C_RSTC_RCR
LDR r3, =0xA5000005
STR r1, [r0]
STR r3, [r2]
END
AT91SAM9263
1079
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