upd70f3402 Renesas Electronics Corporation., upd70f3402 Datasheet - Page 833

• Manufacturer Part Number: upd70f3402
• Description: 32-/16-bit Single-chip Microcontroller With Can Interface
• Manufacturer: Renesas Electronics Corporation.

V850E/RS1 should be soldered and mounted under the following recommended conditions.
For soldering methods and condition other than those recommended below, contact an NEC
Electronics sales representative. For technical information, see the follow website:
Note: After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable
Caution:
Infrared reflow
VPS
Partial heating
Soldering Method
µPD70F3402GC(A1)-8EA
µPD70F3403GC(A)-8EA
µPD70F3403AGC(A)-8EA
storage period.
Do not use different soldering methods together.
Chapter 29 Recommended Soldering Conditions
Package peak temperature: 235°C,
Time: 30 seconds max. (at 210°C or higher),
Count: 3 times or less,
Exposure limits: 7days
for 20 to 72 hours)
Package peak temperature: 215°C,
Time: 25 to 40 seconds max. (at 200°C or higher),
Count: 3 times or less,
Exposure limits: 7days
for 20 to 72 hours)
Pin temperature: 350°C max.
Time: 3 seconds max. (per pin row)
User’s Manual U16702EE3V2UD00
Table 29-1: Soldering Conditions
100-pin plastic LQFP (Fine pitch) (14 × 14)
100-pin plastic LQFP (Fine pitch) (14 × 14)
100-pin plastic LQFP (Fine pitch) (14 × 14)
http://www.ee.nec.de
Soldering Condition
Note
Note
(after that, prebake at 125°C
(after that, prebake at 125°C
Soldering Condition
Recommended
VP15-207-3
IR35-207-3
Symbol of
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