UPD70F3738GF-GAS-AX Renesas Electronics America, UPD70F3738GF-GAS-AX Datasheet - Page 1028

• Manufacturer Part Number: UPD70F3738GF-GAS-AX
• Description: MCU 32BIT V850ES/JX3-L 100-LQFP
• Manufacturer: Renesas Electronics America
• Series: V850ES/Jx3-Lr

Specifications of UPD70F3738GF-GAS-AX

• Core Processor: RISC
• Core Size: 32-Bit
• Speed: 20MHz
• Connectivity: CSI, EBI/EMI, I²C, UART/USART
• Peripherals: DMA, LVD, PWM, WDT
• Number Of I /o: 84
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 2.2 V ~ 3.6 V
• Data Converters: A/D 12x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: *
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

(2)
Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together.
Remarks 1. The V850ES/JG3-L is a lead-free product.
(3)
1026
Soldering Method
Infrared reflow
Undifined
μ
μ
μ
μ
μ
μ
PD70F3737F1-CAH-A:
PD70F3738F1-CAH-A:
PD70F3792GC-UEU-AX:
PD70F3793GC-UEU-AX:
PD70F3792F1-CAH-A:
PD70F3793F1-CAH-A:
2. For soldering methods and conditions other than those recommended above, please contact an NEC
Electronics sales representative.
Package peak temperature: 260°C, Time: 60 seconds max. (at 220°C or higher),
Count: Three times or less, Exposure limit: 7 days
to 72 hours)
Table 35-1. Surface Mounting Type Soldering Conditions (2/2)
CHAPTER 35 RECOMMENDED SOLDERING CONDITIONS
121-pin plastic FBGA (8 × 8)
121-pin plastic FBGA (8 × 8)
100-pin plastic LQFP (fine pitch) (14 × 14)
121-pin plastic FBGA (8 × 8)
121-pin plastic FBGA (8 × 8)
100-pin plastic LQFP (fine pitch) (14 × 14)
User’s Manual U18953EJ5V0UD
Soldering Conditions
Note
(after that, prebake at 125°C for 10
IR60-107-3
Condition Symbol
Recommended