DF2117VLP20V Renesas Electronics America, DF2117VLP20V Datasheet - Page 44

• Manufacturer Part Number: DF2117VLP20V
• Description: IC H8S/2117 MCU FLASH 145TFLGA
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2100r

Specifications of DF2117VLP20V

• Core Processor: H8S/2600
• Core Size: 16-Bit
• Speed: 20MHz
• Connectivity: FIFO, I²C, LPC, SCI, SmartCard
• Peripherals: POR, PWM, WDT
• Number Of I /o: 112
• Program Memory Size: 160KB (160K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 16x10b
• Oscillator Type: External
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 145-TFLGA
• For Use With: HS0005KCU11H - EMULATOR E10A-USB H8S(X),SH2(A)3DK2166 - DEV EVAL KIT H8S/2166
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

19.6 Usage Note......................................................................................................................... 652
Section 20 A/D Converter .................................................................................655
20.1 Features.............................................................................................................................. 655
20.2 Input/Output Pins............................................................................................................... 657
20.3 Register Descriptions ......................................................................................................... 658
20.4 Operation ........................................................................................................................... 663
20.5 Interrupt Source ................................................................................................................. 667
20.6 A/D Conversion Accuracy Definitions .............................................................................. 667
20.7 Usage Notes ....................................................................................................................... 669
Section 21 RAM ................................................................................................673
Section 22 Flash Memory..................................................................................675
22.1 Features.............................................................................................................................. 675
22.2 Mode Transition Diagram.................................................................................................. 676
22.3 Flash Memory MAT Configuration ................................................................................... 678
22.4 Block Structure .................................................................................................................. 679
22.5 Programming/Erasing Interface ......................................................................................... 680
22.6 Input/Output Pins............................................................................................................... 682
22.7 Register Descriptions ......................................................................................................... 683
22.8 On-Board Programming Mode .......................................................................................... 701
Rev. 3.00 Sep. 28, 2009 Page xlii of xliv
REJ09B0350-0300
19.5.2 SMI, HIRQ1, HIRQ3, HIRQ4, HIRQ5, HIRQ6, HIRQ7, HIRQ8, HIRQ9,
19.6.1 Data Conflict......................................................................................................... 652
20.3.1 A/D Data Registers A to H (ADDRA to ADDRH) .............................................. 659
20.3.2 A/D Control/Status Register (ADCSR) ................................................................ 660
20.3.3 A/D Control Register (ADCR) ............................................................................. 662
20.4.1 Single Mode.......................................................................................................... 663
20.4.2 Scan Mode ............................................................................................................ 664
20.4.3 Input Sampling and A/D Conversion Time .......................................................... 665
20.7.1 Module Stop Mode Setting ................................................................................... 669
20.7.2 Permissible Signal Source Impedance .................................................................. 669
20.7.3 Influences on Absolute Accuracy ......................................................................... 670
20.7.4 Setting Range of Analog Power Supply and Other Pins....................................... 670
20.7.5 Notes on Board Design ......................................................................................... 670
20.7.6 Notes on Noise Countermeasures ......................................................................... 671
20.7.7 Module Stop Mode Setting ................................................................................... 672
22.7.1 Programming/Erasing Interface Registers ............................................................ 684
22.7.2 Programming/Erasing Interface Parameters ......................................................... 691
HIRQ10, HIRQ11, HIRQ12, HIRQ13, HIRQ14, and HIRQ15............................ 648