TMP92CF26AXBG Toshiba, TMP92CF26AXBG Datasheet - Page 657

• Manufacturer Part Number: TMP92CF26AXBG
• Description: Microcontrollers (MCU) TLCS-900/H1 ROMLESS 144KB RAM
• Manufacturer: Toshiba

Specifications of TMP92CF26AXBG

• Processor Series: TLCS-900
• Core: 900/H
• Data Bus Width: 16 bit
• Program Memory Type: ROM
• Program Memory Size: 8 KB
• Data Ram Size: 144 KB
• Interface Type: I2C, I2S, UART, USB
• Maximum Clock Frequency: 80 MHz
• Number Of Programmable I/os: 136
• Number Of Timers: 10
• Maximum Operating Temperature: + 50 C
• Mounting Style: SMD/SMT
• Package / Case: FBGA-228
• Development Tools By Supplier: BM1040R0A, BM1055R0B, SW96CN0-ZCC, SW00MN0-ZCC
• Minimum Operating Temperature: 0 C
• On-chip Adc: 10 bit, 6 Channel
• Lead Free Status / Rohs Status: Details

4.
4.1
Electrical Characteristics
parameter
Solderability
Absolute Maximum Ratings
Solderability of lead free products
Test
Note1: If setting it, don’t exceed the Maximum Ratings of DVCC3A (PV port and PW port are DVCC3B).
Note2: In PG0 to PG5, P96,P97,VREFH,VREFL maximum ratings for AVCC is applied.
Note3: The absolute maximum ratings are rated values that must not be exceeded during operation, even for an
T SOLDER
Symbol
DVCC1C
DVCC3A
DVCC3B
DVCC1A
DVCC1B
AVCC
T STG
T OPR
T OPR
Σ IOH
instant. Any one of the ratings must not be exceeded. If any absolute maximum rating is exceeded, a device
may break down or its performance may be degraded, causing it to catch fire or explode resulting in injury to
the user. Thus, when designing products that include this device, ensure that no absolute maximum rating
value will ever be exceeded.
Σ IOL
IOH
V IN
IOL
P D
Use of Sn-37Pb solder Bath
Solder bath temperature = 230°C, Dipping time = 5 seconds
The number of times = one, Use of R-type flux
Use of Sn-3.0Ag-0.5Cu solder bath
Solder bath temperature = 245°C, Dipping time = 5 seconds
The number of times = one, Use of R-type flux (use of lead free)
Power Supply Voltage
Input Voltage
Output Current (1pin)
Output Current (1pin)
Output Current (total)
Output Current (total)
Power Dissipation (Ta = 85°C)
Soldering Temperature (10s)
Storage Temperature
Operation Temperature
Operation Temperature
(80MHz)
Contents
Test condition
92CF26A-656
-0.3 ∼ DVCC3A/3B+0.3 (Note1)
-0.3 to AVCC + 0.3 (Note2)
-0.3 to 3.9
-0.3 to 3.0
-0.3 to 3.9
-65 to 150
Rating
-0 to 70
-0 to 50
600
260
-15
-50
15
80
Pass:
solderability rate until forming ≥ 95%
Unit
mW
mA
mA
mA
mA
°C
°C
°C
°C
Note
TMP92CF26A
V
V
2007-11-21