UPD70F3737GC-UEU-AX Renesas Electronics America, UPD70F3737GC-UEU-AX Datasheet - Page 791

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UPD70F3737GC-UEU-AX

Manufacturer Part Number
UPD70F3737GC-UEU-AX
Description
MCU 32BIT V850ES/JX3-L 100-LQFP
Manufacturer
Renesas Electronics America
Series
V850ES/Jx3-Lr
Datasheet

Specifications of UPD70F3737GC-UEU-AX

Package / Case
*
Voltage - Supply (vcc/vdd)
2.2 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Speed
20MHz
Number Of I /o
84
Core Processor
RISC
Program Memory Type
FLASH
Ram Size
8K x 8
Program Memory Size
128KB (128K x 8)
Data Converters
A/D 12x10b, D/A 2x8b
Oscillator Type
Internal
Peripherals
DMA, LVD, PWM, WDT
Connectivity
CSI, EBI/EMI, I²C, UART/USART
Core Size
32-Bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
UPD70F3737GC-UEU-AX
Manufacturer:
Renesas Electronics America
Quantity:
10 000
29.2.4 Cautions
(1) Handling of device that was used for debugging
(2) When breaks cannot be executed
(3) When pseudo real-time RAM monitor (RRM) function and DMM function do not operate
(4) Standby release with pseudo RRM and DMM functions enabled
(5) Writing to peripheral I/O registers that requires a specific sequence, using DMM function
(6) Flash self programming
(7) On-chip debugging can be used when the supply voltage (V
• Interrupts are disabled (DI)
• Interrupts issued for the serial interface, which is used for communication between MINICUBE2 and the
• Standby mode is entered while standby release by a maskable interrupt is prohibited
• Mode for communication between MINICUBE2 and the target device is UARTA0, and the main clock has
• Interrupts are disabled (DI)
• Interrupts issued for the serial interface, which is used for communication between MINICUBE2 and the
• Standby mode is entered while standby release by a maskable interrupt is prohibited
• Mode for communication between MINICUBE2 and the target device is UARTA0, and the main clock has
• Mode for communication between MINICUBE2 and the target device is UARTA0, and a clock different from
• Mode for communication between MINICUBE2 and the target device is CSIB0 or CSIB3
• Mode for communication between MINICUBE2 and the target device is UARTA0, and the main clock has
Do not mount a device that was used for debugging on a mass-produced product, because the flash memory
was rewritten during debugging and the number of rewrites of the flash memory cannot be guaranteed.
Moreover, do not embed the debug monitor program into mass-produced products.
Forced breaks cannot be executed if one of the following conditions is satisfied.
The pseudo RRM function and DMM function do not operate if one of the following conditions is satisfied.
The standby mode is released by the pseudo RRM function and DMM function if one of the following
conditions is satisfied.
Peripheral I/O registers that requires a specific sequence cannot be written with the DMM function.
If a space where the debug monitor program is allocated is rewritten by flash self programming, the debugger
can no longer operate normally.
at less than 2.7 V.
target device, are masked
been stopped
target device, are masked
been stopped
the one specified in the debugger is used for communication
been supplied.
CHAPTER 29 ON-CHIP DEBUG FUNCTION
Preliminary User’s Manual U18953EJ1V0UD
DD
) is in a range of 2.7 to 3.6 V. It cannot be used
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