HD64F2218UTF24 Renesas Electronics America, HD64F2218UTF24 Datasheet - Page 749

IC H8S MCU FLASH 128K 100-TQFP

HD64F2218UTF24

Manufacturer Part Number
HD64F2218UTF24
Description
IC H8S MCU FLASH 128K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2200r
Datasheets

Specifications of HD64F2218UTF24

Core Processor
H8S/2000
Core Size
16-Bit
Speed
24MHz
Connectivity
SCI, SmartCard, USB
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
69
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
12K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 6x10b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
For Use With
3DK2218-SS - KIT DEV H8S/2218 WINDOWS SIDESHW
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD64F2218UTF24
Manufacturer:
RENESAS
Quantity:
14
Part Number:
HD64F2218UTF24V
Manufacturer:
RENESAS/瑞萨
Quantity:
20 000
P-LQFP64-10x10-0.50
JEITA Package Code
49
64
Z
e
D
48
1
PLQP0064KC-A
RENESAS Code
Figure C.3 FP-64E and FP-64EV Package Dimensions
*1
Index mark
D
H
D
y
*3
b
p
33
16
FP-64E/FP-64EV
Previous Code
x
32
17
M
F
MASS[Typ.]
0.4g
Rev.7.00 Dec. 24, 2008 Page 693 of 698
Terminal cross section
Detail F
b
b
p
1
L
1
L
θ
REJ09B0074-0700
NOTE)
1. DIMENSIONS"*1"AND"*2"
2. DIMENSION"*3"DOES NOT
DO NOT INCLUDE MOLD FLASH
INCLUDE TRIM OFFSET.
Reference
Symbol
e
D
E
A
H
H
A
A
b
b
c
c
θ
x
y
Z
Z
L
L
p
1
1
1
D
E
2
D
E
1
Dimension in Millimeters
11.8 12.0 12.2
11.8
0.00
0.17 0.22 0.27
0.12 0.17 0.22
Min Nom Max
0.3
1.45
12.0
0.10 0.20
0.20
0.15
1.25
1.25
0.5
0.5
1.0
10
10
0.10
12.2
1.70
0.08
0.7

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