HD64F2218UTF24 Renesas Electronics America, HD64F2218UTF24 Datasheet - Page 70

IC H8S MCU FLASH 128K 100-TQFP

HD64F2218UTF24

Manufacturer Part Number
HD64F2218UTF24
Description
IC H8S MCU FLASH 128K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2200r
Datasheets

Specifications of HD64F2218UTF24

Core Processor
H8S/2000
Core Size
16-Bit
Speed
24MHz
Connectivity
SCI, SmartCard, USB
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
69
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
12K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 6x10b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
For Use With
3DK2218-SS - KIT DEV H8S/2218 WINDOWS SIDESHW
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD64F2218UTF24
Manufacturer:
RENESAS
Quantity:
14
Part Number:
HD64F2218UTF24V
Manufacturer:
RENESAS/瑞萨
Quantity:
20 000
Rev.7.00 Dec. 24, 2008 Page 14 of 698
REJ09B0074-0700
PF3/ADTRG/IRQ3
Figure 1.12 Pin Arrangements of HD6432211, HD6432210 and HD6432210S
PA2/RXD2
PA3/SCK2
PA1/TXD2
PF0/IRQ2
Notes:
FWE*
PG0*
P77*
P76*
P75*
PF7/φ
NC*
NC*
VCC
VSS
NMI
1
2
2
2
2
2
2
NC (no connection): These pins should not be connected; they should be left open.
1. The FWE pin is provided only in the flash memory version. It should be fixed low.
2. The port function is enabled (P77, P76, P75, NC, and PG0).
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33
1
2
3 4
(TNP-64B, TNP-64BV)
5 6
7
(Top View)
TNP-64BV
TNP-64B
8 9 10 11 12 13 14 15 16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
PLLVCC
UBPM
PLLVSS
P40/AN0
P41/AN1
P42/AN2
P43/AN3
Vref
P96/AN14
P97/AN15
DrVSS
USD-
USD+
DrVCC
P36 (PUPD+)
VBUS

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