HD64F2218UTF24 Renesas Electronics America, HD64F2218UTF24 Datasheet - Page 645
![IC H8S MCU FLASH 128K 100-TQFP](/photos/12/40/124067/hd64f2218utf24_sml.jpg)
HD64F2218UTF24
Manufacturer Part Number
HD64F2218UTF24
Description
IC H8S MCU FLASH 128K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2200r
Specifications of HD64F2218UTF24
Core Processor
H8S/2000
Core Size
16-Bit
Speed
24MHz
Connectivity
SCI, SmartCard, USB
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
69
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
12K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 6x10b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
For Use With
3DK2218-SS - KIT DEV H8S/2218 WINDOWS SIDESHW
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD64F2218UTF24V
Manufacturer:
RENESAS/瑞萨
Quantity:
20 000
- Current page: 645 of 758
- Download datasheet (5Mb)
V
FWE
MD2 to MD0*
RES
SWE1 bit
φ
CC
Notes:
Period during which flash memory access is prohibited
(x: Wait time after setting SWE1 bit)*
Period during which flash memory can be programmed
(Execution of program in flash memory prohibited, and data reads other than verify operations
prohibited)
1.
2.
3.
1
Except when switching modes, the level of the mode pins (MD2 to MD0) must be fixed until
power-off by pulling the pins up or down.
See section 22.7, Flash Memory Characteristics.
Mode programming setup time t
Figure 17.16 Power-On/Off Timing (Boot Mode)
t
OSC1
SWE1 set
t
Wait time:
MDS
t
MDS
*
3
2
MDS
*
3
(min) = 200 ns.
x
Programming/
erasing
possible
Rev.7.00 Dec. 24, 2008 Page 589 of 698
Wait time:
min 0 μs
SWE1 cleared
θ
min 0 μs
REJ09B0074-0700
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