HD64F2218UTF24 Renesas Electronics America, HD64F2218UTF24 Datasheet - Page 58

• Manufacturer Part Number: HD64F2218UTF24
• Description: IC H8S MCU FLASH 128K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2200r

Specifications of HD64F2218UTF24

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 24MHz
• Connectivity: SCI, SmartCard, USB
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 69
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 12K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 6x10b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• For Use With: 3DK2218-SS - KIT DEV H8S/2218 WINDOWS SIDESHW
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

• General I/O ports
• Supports various power-down states
• Compact package
Note:
Rev.7.00 Dec. 24, 2008 Page 2 of 698
REJ09B0074-0700
Package
TQFP-100
P-LFBGA-112
LQFP-64
VQFN-64
ROM
Flash memory Version
Masked ROM Version
H8S/2212 Group
I/O pins: 69 for the H8S/2218 Group, 37 for the H8S/2212 Group
*
A V appended to the end of the package code indicates a lead-free version.
Code*
TFP-100G, TFP-100GV
BP-112, BP-112V
FP-64E, FP-64EV
TNP-64B, TNP-64BV
Part No.
HD64F2212
HD64F2212U
HD64F2212CU
HD64F2211
HD64F2211U
HD64F2211CU
HD64F2210CU
HD6432211
HD6432210
HD6432210S
Body Size
12.0 × 12.0 mm
10.0 × 10.0 mm
10.0 × 10.0 mm
8.0 × 8.0 mm
ROM
128 kbytes
128 kbytes
128 kbytes
64 kbytes
64 kbytes
64 kbytes
32 kbytes
64 kbytes
32 kbytes
32 kbytes
RAM
12 kbytes
12 kbytes
12 kbytes
8 kbytes
8 kbytes
8 kbytes
8 kbytes
8 kbytes
4 kbytes
4 kbytes
Pin Pitch
0.4 mm
0.8 mm
0.5 mm
0.4 mm
Remarks
⎯
⎯
⎯
SCI boot mode
USB boot mode
USB boot mode
SCI boot mode
USB boot mode
USB boot mode
USB boot mode
Remarks
H8S/2218 Group
H8S/2212 Group