HD64F2218UTF24 Renesas Electronics America, HD64F2218UTF24 Datasheet - Page 37

• Manufacturer Part Number: HD64F2218UTF24
• Description: IC H8S MCU FLASH 128K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2200r

Specifications of HD64F2218UTF24

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 24MHz
• Connectivity: SCI, SmartCard, USB
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 69
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 12K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 6x10b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• For Use With: 3DK2218-SS - KIT DEV H8S/2218 WINDOWS SIDESHW
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

Section 22 Electrical Characteristics
22.1 Absolute Maximum Ratings ............................................................................................. 657
22.2 Power Supply Voltage and Operating Frequency Range .................................................. 658
22.3 DC Characteristics ............................................................................................................ 659
22.4 AC Characteristics ............................................................................................................ 663
22.5 USB Characteristics .......................................................................................................... 680
22.6 A/D Conversion Characteristics........................................................................................ 682
22.7 Flash Memory Characteristics........................................................................................... 683
22.8 Usage Note........................................................................................................................ 684
Appendix
A.
B.
C.
Index
22.4.1 Clock Timing ....................................................................................................... 664
22.4.2 Control Signal Timing ......................................................................................... 666
22.4.3 Bus Timing .......................................................................................................... 668
22.4.4 Timing of On-Chip Supporting Modules ............................................................. 675
I/O Port States in Each Processing State ........................................................................... 685
Product Model Lineup ...................................................................................................... 689
Package Dimensions ......................................................................................................... 691
............................................................................................................................. 685
............................................................................................................................. 695
.............................................................................. 657
Rev.7.00 Dec. 24, 2008 Page xxxv of liv
REJ09B0074-0700