HD64F2218UTF24 Renesas Electronics America, HD64F2218UTF24 Datasheet - Page 495

IC H8S MCU FLASH 128K 100-TQFP

HD64F2218UTF24

Manufacturer Part Number
HD64F2218UTF24
Description
IC H8S MCU FLASH 128K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2200r
Datasheets

Specifications of HD64F2218UTF24

Core Processor
H8S/2000
Core Size
16-Bit
Speed
24MHz
Connectivity
SCI, SmartCard, USB
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
69
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
12K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 6x10b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
For Use With
3DK2218-SS - KIT DEV H8S/2218 WINDOWS SIDESHW
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD64F2218UTF24
Manufacturer:
RENESAS
Quantity:
14
Part Number:
HD64F2218UTF24V
Manufacturer:
RENESAS/瑞萨
Quantity:
20 000
[Slave LSI_A]
[Slave LSI_B]
[Master LSI]
(SEL_A)
(SEL_B)
RSR0_A
RSR0_B
SCK0_A
SCK0_B
IRQ7_A
IRQ7_B
TxD0_A
TxD0_B
M_SCK
M_RxD
M_TxD
SEL_A
SEL_B
Figure 12.37 Example of Communication Using the SCI Select Function
Hi-Z
Communication between master LSI
D0
D0
D0
and slave LSI_A
Fixed high level
D0
Hi-Z
D1
D1
D1
D6
Period of M_SCK = high
D7
D7
D7
D7
Rev.7.00 Dec. 24, 2008 Page 439 of 698
D0
D0
D0
Communication between master LSI
D0
Fixed high level
Hi-Z
and slave LSI_B
D1
D1
D1
D6
REJ09B0074-0700
D7
D7
D7
D7
Hi-Z

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