HD64F2218UTF24 Renesas Electronics America, HD64F2218UTF24 Datasheet - Page 35

• Manufacturer Part Number: HD64F2218UTF24
• Description: IC H8S MCU FLASH 128K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2200r

Specifications of HD64F2218UTF24

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 24MHz
• Connectivity: SCI, SmartCard, USB
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 69
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 12K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 6x10b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• For Use With: 3DK2218-SS - KIT DEV H8S/2218 WINDOWS SIDESHW
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

17.9 Program/Erase Protection.................................................................................................. 583
17.10 Interrupt Handling when Programming/Erasing Flash Memory....................................... 584
17.11 Programmer Mode ............................................................................................................ 585
17.12 Power-Down States for Flash Memory............................................................................. 586
17.13 Flash Memory Programming and Erasing Precautions ..................................................... 587
17.14 Note on Switching from F-ZTAT Version to Masked ROM Version .............................. 592
Section 18 Masked ROM
18.1 Features ............................................................................................................................. 593
Section 19 Clock Pulse Generator
19.1 Register Descriptions ........................................................................................................ 596
19.2 System Clock Oscillator.................................................................................................... 600
19.3 Duty Adjustment Circuit ................................................................................................... 602
19.4 Medium-Speed Clock Divider .......................................................................................... 602
19.5 Bus Master Clock Selection Circuit .................................................................................. 602
19.6 Subclock Oscillator ........................................................................................................... 603
19.7 Subclock Waveform Generation Circuit ........................................................................... 604
19.8 PLL Circuit for USB ......................................................................................................... 604
19.9 Usage Notes ...................................................................................................................... 605
Section 20 Power-Down Modes
20.1 Register Descriptions ........................................................................................................ 611
20.2 Medium-Speed Mode........................................................................................................ 617
17.8.2 Erase/Erase-Verify............................................................................................... 581
17.9.1 Hardware Protection ............................................................................................ 583
17.9.2 Software Protection.............................................................................................. 583
17.9.3 Error Protection.................................................................................................... 583
19.1.1 System Clock Control Register (SCKCR) ........................................................... 596
19.1.2 Low Power Control Register (LPWRCR)............................................................ 597
19.2.1 Connecting a Crystal Resonator........................................................................... 600
19.2.2 Inputting External Clock...................................................................................... 601
19.6.1 Connecting 32.768-kHz Crystal Resonator.......................................................... 603
19.6.2 Handling Pins when Subclock Not Required....................................................... 603
19.9.1 Note on Crystal Resonator ................................................................................... 605
19.9.2 Note on Board Design.......................................................................................... 605
19.9.3 Note on Switchover of External Clock ................................................................ 605
20.1.1 Standby Control Register (SBYCR) .................................................................... 611
20.1.2 Timer Control/Status Register (TCSR_1) ............................................................ 613
20.1.3 Module Stop Control Registers A to C (MSTPCRA to MSTPCRC)................... 614
20.1.4 Extended Module Stop Register (EXMDLSTP).................................................. 617
.................................................................................................. 593
...................................................................................... 607
.................................................................................. 595
Rev.7.00 Dec. 24, 2008 Page xxxiii of liv
REJ09B0074-0700