dac1628d1g25 NXP Semiconductors, dac1628d1g25 Datasheet - Page 34

• Manufacturer Part Number: dac1628d1g25
• Description: Dual 16-bit Dac Jesd204b Interface Up To 1.25 Gsps; X2, X4 And X8 Interpolating
• Manufacturer: NXP Semiconductors

NXP Semiconductors
DAC1628D1G25
Objective data sheet
Also, include individual LC decoupling for the following six sets of power pins:
Use at least two capacitors for each power pin decoupling. Locate these capacitors as
close as possible to the DAC1628D1G25 power pins.
Use a separate LDO for the generation of the 1.8 V analog power (V
digital power (V
The die pad is used for both the power dissipation and electrical grounding. Insert several
vias (typically 7  7 to connect the internal ground plane to the top layer die area.
•
•
•
V
V
V
DDA(1V8)
DDD(1V8)
DDA(3V3)
(pins 43, 46, 48, 51, 53 and 56)
(core: pins 7, 10, 15, 16, 19, 22, 25, 28, 33 and 36)
(pins 47 and 52)
DDD1V8
All information provided in this document is subject to legal disclaimers.
Rev. 1.1 — 10 October 2011
) to ensure the best performance.
Dual 16-bit DAC: JESD204B interface; up to 1.25 Gsps
DAC1628D1G25
DDA(1V8)
© NXP B.V. 2011. All rights reserved.
and the 1.8 V
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