HD6417709SF133B Renesas Electronics America, HD6417709SF133B Datasheet - Page 406

IC SUPERH MPU ROMLESS 208LQFP

HD6417709SF133B

Manufacturer Part Number
HD6417709SF133B
Description
IC SUPERH MPU ROMLESS 208LQFP
Manufacturer
Renesas Electronics America
Series
SuperH® SH7700r
Datasheet

Specifications of HD6417709SF133B

Core Processor
SH-3
Core Size
32-Bit
Speed
133MHz
Connectivity
EBI/EMI, FIFO, IrDA, SCI, SmartCard
Peripherals
DMA, POR, WDT
Number Of I /o
96
Program Memory Type
ROMless
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
1.65 V ~ 2.05 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
208-LQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-

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Rev. 5.00, 09/03, page 360 of 760
Bus cycle
Bus cycle
Burst Mode
Once the bus is obtained, the transfer is performed continuously until the transfer end
condition is satisfied. In external request mode with low level detection of the DREQ pin,
however, when the DREQ pin is driven high, the bus passes to the other bus master after the
DMAC transfer request that has already been accepted ends, even if the transfer end conditions
have not been satisfied.
Burst mode cannot be used when a serial communication interface (IrDA, SCI), or A/D
converter is the transfer request source. Figure 11.13 shows an example of burst mode timing.
DREQ
DREQ
CPU
CPU
Figure 11.12 Example of DMA Transfer in Cycle-Steal Mode
Figure 11.13 Example of Transfer in Burst Mode
CPU
CPU
CPU
CPU
DMAC DMAC DMAC
DMAC DMAC
Read
Read
Write
Write
Bus returned to CPU
Read
CPU DMAC DMAC CPU
DMAC DMAC
Read
Write
Read
Write
DMAC
Write
CPU
CPU

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