HD6417709SF133B Renesas Electronics America, HD6417709SF133B Datasheet - Page 358

IC SUPERH MPU ROMLESS 208LQFP

HD6417709SF133B

Manufacturer Part Number
HD6417709SF133B
Description
IC SUPERH MPU ROMLESS 208LQFP
Manufacturer
Renesas Electronics America
Series
SuperH® SH7700r
Datasheet

Specifications of HD6417709SF133B

Core Processor
SH-3
Core Size
32-Bit
Speed
133MHz
Connectivity
EBI/EMI, FIFO, IrDA, SCI, SmartCard
Peripherals
DMA, POR, WDT
Number Of I /o
96
Program Memory Type
ROMless
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
1.65 V ~ 2.05 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
208-LQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD6417709SF133B
Manufacturer:
RENESAS
Quantity:
79
Part Number:
HD6417709SF133B
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Part Number:
HD6417709SF133B
Manufacturer:
RENESAS/瑞萨
Quantity:
20 000
Part Number:
HD6417709SF133B-V
Manufacturer:
RENESAS/瑞萨
Quantity:
20 000
Part Number:
HD6417709SF133BV
Manufacturer:
RENESAS
Quantity:
1 000
Part Number:
HD6417709SF133BV
Manufacturer:
RENESAS/瑞萨
Quantity:
20 000
Memory Card Interface Burst Timing: In the SH7709S, when the IC memory card interface is
selected, page mode burst access mode can be used, for read access only, by setting bits A5BST1
and A5BST0 in BCR1 for physical space area 5, or bits A6BST1 and A6BST0 in BCR1 for area
6. This burst access mode is not stipulated in JEIDA version 4.2 (PCMCIA2.1), but allows high-
speed data access using ROM provided with a burst mode, etc.
Burst access mode timing is shown in figures 10.34 and 10.35.
Rev. 5.00, 09/03, page 312 of 760
CKIO
A25 to A4
A3 to A0
CExx
RD/WR
RD
(read)
D15 to D0
(read)
BS
Figure 10.34 Basic Timing for PCMCIA Memory Card Interface Burst Access
Tpcm1
Tpcm2
Tpcm1
Tpcm2
Tpcm1
Tpcm2
Tpcm1
Tpcm2

Related parts for HD6417709SF133B