MPC564CZP40 Freescale Semiconductor, MPC564CZP40 Datasheet - Page 1309

IC MPU 32BIT W/CODE COMP 388PBGA

MPC564CZP40

Manufacturer Part Number
MPC564CZP40
Description
IC MPU 32BIT W/CODE COMP 388PBGA
Manufacturer
Freescale Semiconductor
Series
MPC5xxr
Datasheets

Specifications of MPC564CZP40

Core Processor
PowerPC
Core Size
32-Bit
Speed
40MHz
Connectivity
CAN, EBI/EMI, SCI, SPI, UART/USART
Peripherals
POR, PWM, WDT
Number Of I /o
56
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 2.7 V
Data Converters
A/D 32x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
388-BGA
Processor Series
MPC5xx
Core
PowerPC
Data Bus Width
32 bit
Data Ram Size
32 KB
Interface Type
CAN, JTAG, QSPI, SCI, SPI, UART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
56
Number Of Timers
2
Operating Supply Voltage
0 V to 5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
On-chip Adc
2 (10 bit, 32 Channel)
For Use With
MPC564EVB - KIT EVAL FOR MPC561/562/563/564
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Lead Free Status / Rohs Status
No

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MPC564CZP40
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
This device contains circuitry protecting against damage due to high static voltage or electrical fields;
however, it is advised that normal precautions be taken to avoid application of any voltages higher than
maximum-rated voltages to this high-impedance circuit. Reliability of operation is enhanced if unused
inputs are tied to an appropriate logic voltage level (e.g., either V
G.2
The MPC561/MPC563 is available in packaged form. The package is a 388-ball PBGA having a 1.0 mm
ball pitch, Freescale case outline 1164-01 (See
G.3
G.3.1
The document referenced for the EMC testing of MPC561/MPC563 is SAE J1752/3 Issued 1995-03
G.3.2
EMC – Electromagnetic Compatibility
EMI – Electromagnetic Interference
TEM cell – Transverse Electromagnetic Mode cell
G.3.3
G.4
Freescale Semiconductor
1. Scan range: 150 KHz – 1000 MHz
2. Operating Frequency: 66 MHz
3. Operating Voltages: 2.6 V, 5.0 V
4. Max spikes: TBD dBuV
5. I/O port waveforms: Per J1752/3
6. Temperature: 25 °C
BGA Package Thermal Resistance,
Junction to Ambient – Natural Convection
BGA Package Thermal Resistance,
Junction to Ambient – Four layer (2s2p) board, natural
convection
Package
EMI Characteristics
Thermal Characteristics
Reference Documents
Definitions and Acronyms
EMI Testing Specifications
Negative current flows out of the pin and positive current flows into the pin.
Characteristic
MPC561/MPC563 Reference Manual, Rev. 1.2
Table G-2. Thermal Characteristics
Figure G-63
NOTE
Symbol
R
R
θJMA
and
θJA
Figure
SS
or V
G-64).
47.3
29.4
DD
Value
).
1,2,3
3,4
,
5
66-MHz Electrical Characteristics
°C/W
°C/W
Unit
G-3

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