LPC1837FET256,551 NXP Semiconductors, LPC1837FET256,551 Datasheet - Page 787

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LPC1837FET256,551

Manufacturer Part Number
LPC1837FET256,551
Description
Microcontrollers (MCU) 32BIT ARM CORTEX-M3 MCU 136KB SRAM
Manufacturer
NXP Semiconductors
Series
LPC18xxr

Specifications of LPC1837FET256,551

Core
ARM Cortex M3
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
150MHz
Connectivity
CAN, EBI/EMI, Ethernet, I²C, Microwire, SD/MMC, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Number Of I /o
80
Program Memory Size
1MB (1M x 8)
Program Memory Type
FLASH
Eeprom Size
-
Ram Size
136K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 16x10b; D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
256-LBGA
Lead Free Status / Rohs Status
 Details
Other names
935293795551
NXP Semiconductors
<Document ID>
User manual
Fig 108. I2S connections
The MCLK can be provided by a master or used by the master to create the I2S CLK.
MCLK can also be generated internally by the audio PLL through the CREG block (see
Table
37).
All information provided in this document is subject to legal disclaimers.
Rev. 00.13 — 20 July 2011
Chapter 35: LPC18xx I2S interface
UM10430
© NXP B.V. 2011. All rights reserved.
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