LPC1837FET256,551 NXP Semiconductors, LPC1837FET256,551 Datasheet - Page 314
LPC1837FET256,551
Manufacturer Part Number
LPC1837FET256,551
Description
Microcontrollers (MCU) 32BIT ARM CORTEX-M3 MCU 136KB SRAM
Manufacturer
NXP Semiconductors
Series
LPC18xxr
Datasheets
1.LPC1830FET256551.pdf
(87 pages)
2.LPC1810FET100551.pdf
(2 pages)
3.LPC1810FET100551.pdf
(1164 pages)
Specifications of LPC1837FET256,551
Core
ARM Cortex M3
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
150MHz
Connectivity
CAN, EBI/EMI, Ethernet, I²C, Microwire, SD/MMC, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Number Of I /o
80
Program Memory Size
1MB (1M x 8)
Program Memory Type
FLASH
Eeprom Size
-
Ram Size
136K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 16x10b; D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
256-LBGA
Lead Free Status / Rohs Status
Details
Other names
935293795551
- Current page: 314 of 1164
- Download datasheet (8Mb)
NXP Semiconductors
Table 244. FIFO Threshold Watermark Register (FIFOTH, address 0x4000 404C) bit description
<Document ID>
User manual
Bit
30:28
31
Symbol
DW_DMA_MUTIP
LE_
TRANSACTION_
SIZE
-
Value
0x0
0x1
0x2
0x3
0x4
0x5
0x6
0x7
All information provided in this document is subject to legal disclaimers.
Description
Burst size of multiple transaction; should be programmed same as
DW-DMA controller multiple-transaction-size SRC/DEST_MSIZE.The
units for transfers is the H_DATA_WIDTH parameter. A single transfer
(dw_dma_single assertion in case of Non DW DMA interface) would
be signalled based on this value. Value should be sub-multiple of
(RX_WMark + 1)* (F_DATA_WIDTH/H_DATA_WIDTH) and
(FIFO_DEPTH - TX_WMark)* (F_DATA_WIDTH/ H_DATA_WIDTH)
For example, if FIFO_DEPTH = 16, FDATA_WIDTH ==
H_DATA_WIDTH
Allowed combinations for MSize and TX_WMark are:
MSize = 1,
TX_WMARK = 1-15
MSize = 4,
TX_WMark = 8
MSize = 4,
TX_WMark = 4
MSize = 4,
TX_WMark = 12
MSize = 8,
TX_WMark = 8
MSize = 8,
TX_WMark = 4.
Allowed combinations for MSize and RX_WMark are:
MSize = 1,
RX_WMARK = 0-14
MSize = 4,
RX_WMark = 3
MSize = 4,
RX_WMark = 7
MSize = 4,
RX_WMark = 11
MSize = 8,
RX_WMark = 7
MSize = 8,
RX_WMark = 11
Recommended: MSize = 8, TX_WMark = 8, RX_WMark = 7
1 transfer
4 transfers
8 transfers
16 transfers
32 transfers
64 transfers
128 transfers
256 transfers
Reserved
Rev. 00.13 — 20 July 2011
Chapter 18: LPC18xx SD/MMC interface
UM10430
© NXP B.V. 2011. All rights reserved.
314 of 1164
Reset
value
0
Related parts for LPC1837FET256,551
Image
Part Number
Description
Manufacturer
Datasheet
Request
R
Part Number:
Description:
NXP Semiconductors designed the LPC2420/2460 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2458 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2468 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2470 microcontroller, powered by theARM7TDMI-S core, to be a highly integrated microcontroller for a wide range ofapplications that require advanced communications and high quality graphic displays
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2478 microcontroller, powered by theARM7TDMI-S core, to be a highly integrated microcontroller for a wide range ofapplications that require advanced communications and high quality graphic displays
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The Philips Semiconductors XA (eXtended Architecture) family of 16-bit single-chip microcontrollers is powerful enough to easily handle the requirements of high performance embedded applications, yet inexpensive enough to compete in the market for hi
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The Philips Semiconductors XA (eXtended Architecture) family of 16-bit single-chip microcontrollers is powerful enough to easily handle the requirements of high performance embedded applications, yet inexpensive enough to compete in the market for hi
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The XA-S3 device is a member of Philips Semiconductors? XA(eXtended Architecture) family of high performance 16-bitsingle-chip microcontrollers
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The NXP BlueStreak LH75401/LH75411 family consists of two low-cost 16/32-bit System-on-Chip (SoC) devices
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The NXP LPC3130/3131 combine an 180 MHz ARM926EJ-S CPU core, high-speed USB2
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The NXP LPC3141 combine a 270 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
Part Number:
Description:
The NXP LPC3143 combine a 270 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
Part Number:
Description:
The NXP LPC3152 combines an 180 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
Part Number:
Description:
The NXP LPC3154 combines an 180 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
Part Number:
Description:
Standard level N-channel enhancement mode Field-Effect Transistor (FET) in a plastic package using NXP High-Performance Automotive (HPA) TrenchMOS technology
Manufacturer:
NXP Semiconductors
Datasheet: