UPD70F3771GF-GAT-AX Renesas Electronics America, UPD70F3771GF-GAT-AX Datasheet - Page 17

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UPD70F3771GF-GAT-AX

Manufacturer Part Number
UPD70F3771GF-GAT-AX
Description
MCU 32BIT V850ES/JX3-H 128-LQFP
Manufacturer
Renesas Electronics America
Series
V850ES/Jx3-Hr
Datasheet

Specifications of UPD70F3771GF-GAT-AX

Core Processor
RISC
Core Size
32-Bit
Speed
48MHz
Connectivity
CAN, CSI, EBI/EMI, I²C, UART/USART, USB
Peripherals
DMA, LVD, PWM, WDT
Number Of I /o
96
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
40K x 8
Voltage - Supply (vcc/vdd)
2.85 V ~ 3.6 V
Data Converters
A/D 12x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
*
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

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Part Number
Manufacturer
Quantity
Price
Part Number:
UPD70F3771GF-GAT-AX
Manufacturer:
Renesas Electronics America
Quantity:
10 000
CHAPTER 29 CRC FUNCTION.......................................................................................................... 1348
CHAPTER 30 REGULATOR ............................................................................................................... 1353
CHAPTER 31 FLASH MEMORY ........................................................................................................ 1355
CHAPTER 32 ON-CHIP DEBUG FUNCTION ................................................................................... 1388
CHAPTER 33 ELECTRICAL SPECIFICATIONS ............................................................................... 1409
28.5 RAM Retention Voltage Detection Operation.................................................................... 1346
29.1 Functions .............................................................................................................................. 1348
29.2 Configuration........................................................................................................................ 1348
29.3 Registers ............................................................................................................................... 1349
29.4 Operation .............................................................................................................................. 1350
29.5 Usage Method....................................................................................................................... 1351
30.1 Overview ............................................................................................................................... 1353
30.2 Operation .............................................................................................................................. 1354
31.1 Features ................................................................................................................................ 1355
31.2 Memory Configuration......................................................................................................... 1356
31.3 Functional Overview ............................................................................................................ 1357
31.4 Rewriting by Dedicated Flash Programmer ...................................................................... 1360
31.5 Rewriting by Self Programming.......................................................................................... 1382
31.6 Creating ROM code to place order for previously written product ................................ 1387
32.1 Debugging with DCU ........................................................................................................... 1389
32.2 Debugging Without Using DCU .......................................................................................... 1394
32.3 ROM Security Function........................................................................................................ 1406
33.1 Absolute Maximum Ratings ................................................................................................ 1409
33.2 Capacitance .......................................................................................................................... 1411
33.3 Operating Conditions .......................................................................................................... 1411
33.4 Oscillator Characteristics.................................................................................................... 1412
28.4.2 To use for interrupt......................................................................................................................1346
31.4.1 Programming environment..........................................................................................................1360
31.4.2 Communication mode .................................................................................................................1361
31.4.3 Flash memory control .................................................................................................................1375
31.4.4 Selection of communication mode ..............................................................................................1376
31.4.5 Communication commands.........................................................................................................1377
31.4.6 Pin connection ............................................................................................................................1378
31.5.1 Overview .....................................................................................................................................1382
31.5.2 Features......................................................................................................................................1383
31.5.3 Standard self programming flow .................................................................................................1384
31.5.4 Flash functions............................................................................................................................1385
31.5.5 Pin processing ............................................................................................................................1385
31.5.6 Internal resources used...............................................................................................................1386
31.6.1 Procedure for using ROM code to place an order .......................................................................1387
32.1.1 Connection circuit example ........................................................................................................1389
32.1.2 Interface signals .........................................................................................................................1389
32.1.3 Maskable functions.....................................................................................................................1391
32.1.4 Register......................................................................................................................................1391
32.1.5 Operation ...................................................................................................................................1393
32.1.6 Cautions .....................................................................................................................................1393
32.2.1 Circuit connection examples.......................................................................................................1394
32.2.2 Maskable functions.....................................................................................................................1397
32.2.3 Securement of user resources ...................................................................................................1398
32.2.4 Cautions .....................................................................................................................................1405
32.3.1 Security ID..................................................................................................................................1406
32.3.2 Setting ........................................................................................................................................1407
33.4.1 Main clock oscillator characteristics ............................................................................................1412

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