OM11077 NXP Semiconductors, OM11077 Datasheet - Page 23
OM11077
Manufacturer Part Number
OM11077
Description
MODULE DIMM LPC2478 ARM7
Manufacturer
NXP Semiconductors
Specifications of OM11077
Accessory Type
Module Card
For Use With/related Products
ARM-57TS-LPC2478
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
568-4742
- Current page: 23 of 792
- Download datasheet (5Mb)
NXP Semiconductors
UM10237_4
User manual
5.2 Memory re-mapping
Table 19.
[1]
[2]
In order to allow for compatibility with future derivatives, the entire Boot ROM is mapped
to the top of the on-chip memory space. In this manner, the use of larger or smaller flash
modules will not require changing the location of the Boot ROM (which would require
changing the Boot Loader code itself) or changing the mapping of the Boot ROM interrupt
vectors. Memory spaces other than the interrupt vectors remain in fixed locations.
Figure 2–9
The portion of memory that is re-mapped to allow interrupt processing in different modes
includes the interrupt vector area (32 bytes) and an additional 32 bytes for a total of
64 bytes, that facilitates branching to interrupt handlers at distant physical addresses. The
remapped code locations overlay addresses 0x0000 0000 through 0x0000 003F. A typical
user program in the flash memory can place the entire FIQ handler at address
0x0000 001C without any need to consider memory boundaries. The vector contained in
the SRAM, external memory, and Boot ROM must contain branches to the actual interrupt
handlers, or to other instructions that accomplish the branch to the interrupt handlers.
There are three reasons this configuration was chosen:
Mode
Boot
Loader
mode
User
Flash
mode
User RAM
mode
User
External
memory
mode
1. To give the FIQ handler in the flash memory the advantage of not having to take a
2. Minimize the need to for the SRAM and Boot ROM vectors to deal with arbitrary
3. To provide space to store constants for jumping beyond the range of single word
See EMCControl register address mirror bit in
Connect external boot memory to chip select 1. During boot from external memory, the address mirror bit is
set and memory bank addresses 0 and 1 are swapped.
memory boundary caused by the remapping into account.
boundaries in the middle of code space.
branch instructions.
LPC2400 Memory mapping modes
Activation
Hardware
activation by
any Reset
Software
activation by
Boot code
Software
activation by
User program
Software
activation by
user code
Software
activation by
boot code
shows the on-chip memory mapping in the modes defined above.
Rev. 04 — 26 August 2009
Usage
The Boot Loader always executes after any reset. The Boot ROM
interrupt vectors are mapped to the bottom of memory to allow
handling exceptions and using interrupts during the Boot Loading
process. A sector of the flash memory (the Boot flash) is available to
hold part of the Boot Code.
For LPC2400 parts with flash only. Activated by the Boot Loader when
a valid User Program Signature is recognized in memory and Boot
Loader operation is not forced. Interrupt vectors are not re-mapped
and are found in the bottom of the flash memory.
Activated by a User Program as desired. Interrupt vectors are
re-mapped to the bottom of the Static RAM.
For LPC2400 parts with flash. Interrupt vectors are re-mapped to
external memory bank 0.
For flashless parts LPC2420/60/70 only. Interrupt vectors are
re-mapped to external memory bank 0.
Table 5–68
[1]
Chapter 2: LPC24XX Memory mapping
for address of external memory bank 0.
[2]
UM10237
© NXP B.V. 2009. All rights reserved.
23 of 792
Related parts for OM11077
Image
Part Number
Description
Manufacturer
Datasheet
Request
R
Part Number:
Description:
NXP Semiconductors designed the LPC2420/2460 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2458 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2468 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2470 microcontroller, powered by theARM7TDMI-S core, to be a highly integrated microcontroller for a wide range ofapplications that require advanced communications and high quality graphic displays
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2478 microcontroller, powered by theARM7TDMI-S core, to be a highly integrated microcontroller for a wide range ofapplications that require advanced communications and high quality graphic displays
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The Philips Semiconductors XA (eXtended Architecture) family of 16-bit single-chip microcontrollers is powerful enough to easily handle the requirements of high performance embedded applications, yet inexpensive enough to compete in the market for hi
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The Philips Semiconductors XA (eXtended Architecture) family of 16-bit single-chip microcontrollers is powerful enough to easily handle the requirements of high performance embedded applications, yet inexpensive enough to compete in the market for hi
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The XA-S3 device is a member of Philips Semiconductors? XA(eXtended Architecture) family of high performance 16-bitsingle-chip microcontrollers
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The NXP BlueStreak LH75401/LH75411 family consists of two low-cost 16/32-bit System-on-Chip (SoC) devices
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The NXP LPC3130/3131 combine an 180 MHz ARM926EJ-S CPU core, high-speed USB2
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The NXP LPC3141 combine a 270 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
Part Number:
Description:
The NXP LPC3143 combine a 270 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
Part Number:
Description:
The NXP LPC3152 combines an 180 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
Part Number:
Description:
The NXP LPC3154 combines an 180 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
Part Number:
Description:
Standard level N-channel enhancement mode Field-Effect Transistor (FET) in a plastic package using NXP High-Performance Automotive (HPA) TrenchMOS technology
Manufacturer:
NXP Semiconductors
Datasheet: