MC9S12P32CFT Freescale Semiconductor, MC9S12P32CFT Datasheet - Page 506

• Manufacturer Part Number: MC9S12P32CFT
• Description: MCU 16BIT 32K FLASH 48-QFN
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12P32CFT

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 32MHz
• Connectivity: CAN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 34
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 4K x 8
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 1.72 V ~ 5.5 V
• Data Converters: A/D 10x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 48-QFN Exposed Pad
• Processor Series: S12P
• Core: HCS12
• 3rd Party Development Tools: EWHCS12
• Development Tools By Supplier: KIT33812ECUEVME, DEMO9S12PFAME
• Package: 48QFN EP
• Family Name: HCS12
• Maximum Speed: 32 MHz
• Operating Supply Voltage: 3.3|5 V
• Data Bus Width: 16 Bit
• Interface Type: CAN/SCI/SPI
• On-chip Adc: 10-chx12-bit
• Number Of Timers: 8
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Electrical Characteristics
P
1. The values for thermal resistance are achieved by package simulations
2. Junction to ambient thermal resistance, θ
3. Junction to ambient thermal resistance, θ
506
Num
IO
10
11
12
13
14
15
horizontal configuration in natural convection.
horizontal configuration in natural convection.
1
2
3
4
5
6
7
8
9
R
R
is the sum of all output currents on I/O ports associated with V
DSON
DSON
P
C
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
INT
Thermal resistance QFN 48, single sided PCB
Thermal resistance QFN 48, double sided PCB
with 2 internal planes
Junction to Board QFN 48
Junction to Case QFN 48
Junction to Case (Bottom) QFN 48
Thermal resistance QFP 80, single sided PCB
Thermal resistance QFP 80, double sided PCB
with 2 internal planes
Junction to Board QFP 80
Junction to Case QFP 80
Junction to Package Top QFP 80
Thermal resistance LQFP 64, single sided PCB
Thermal resistance LQFP 64, double sided PCB
with 2 internal planes
Junction to Board LQFP 64
Junction to Case LQFP 64
Junction to Package Top LQFP 64
=
=
=
V
-------------------------------------- for outputs driven high
V
----------- - for outputs driven low
I
DD35
I
DDR
OL
OL
I
OH
;
–
⋅
V
V
DDR
OH
;
(3)
3
3
+
Table A-5. Thermal Package Characteristics
I
Rating
DDA
(4)
4
(6)
S12P-Family Reference Manual, Rev. 1.13
JA
JA
⋅
V
(5)
was simulated to be equivalent to the JEDEC specification JESD51-2 in a
was simulated to be equivalent to the JEDEC specification JESD51-7 in a
DDA
(7)
5
LQFP 64
QFN 48
QFP 80
2
(2)
2
Symbol
Ψ
Ψ
Ψ
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
JC
JC
JC
JA
JA
JB
JA
JA
JB
JA
JA
JB
JT
JT
JT
DDX
, whereby
Min
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
(1)
Typ
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Freescale Semiconductor
Max
1.4
82
28
11
56
43
28
19
70
52
35
17
4
5
3
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit