DF2328BVF25V Renesas Electronics America, DF2328BVF25V Datasheet - Page 987

IC H8S MCU FLASH 256K 128QFP

DF2328BVF25V

Manufacturer Part Number
DF2328BVF25V
Description
IC H8S MCU FLASH 256K 128QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheets

Specifications of DF2328BVF25V

Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
87
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
128-QFP
For Use With
EDK2329 - DEV EVALUATION KIT H8S/2329
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Other names
HD64F2328BVF25V

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2328BVF25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
(4) DMAC Timing
Note: The DMAC is not supported in the H8S/2321.
Table 22.8 DMAC Timing
Condition A: V
Condition B: V
Item
DREQ setup time
DREQ hold time
TEND delay time
DACK delay time 1
DACK delay time 2
0 V, φ = 2 MHz to 20 MHz, T
T
0 V, φ = 2 MHz to 25 MHz, T
T
a
a
CC
CC
= –40°C to 85°C (wide-range specifications)
= –40°C to 85°C (wide-range specifications)
= 2.7 V to 3.6 V, AV
= 3.0 V to 3.6 V, AV
Symbol
t
t
t
t
t
DRQS
DRQH
TED
DACD1
DACD2
CC
CC
Min
30
10
= 2.7 V to 3.6 V, V
= 3.0 V to 3.6 V, V
Condition A
a
a
= –20°C to 75°C (regular specifications),
= –20°C to 75°C (regular specifications),
Max
20
20
20
Rev.6.00 Sep. 27, 2007 Page 955 of 1268
Min
25
10
Condition B
Section 22 Electrical Characteristics
ref
ref
= 2.7 V to AV
= 3.0 V to AV
Max
18
18
18
Unit
ns
ns
CC
CC
REJ09B0220-0600
, V
, V
Test
Conditions
Figure 22.19
Figure 22.18
Figures 22.16
and 22.17
SS
SS
= AV
= AV
SS
SS
=
=

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