DF2328BVF25V Renesas Electronics America, DF2328BVF25V Datasheet - Page 247

IC H8S MCU FLASH 256K 128QFP

DF2328BVF25V

Manufacturer Part Number
DF2328BVF25V
Description
IC H8S MCU FLASH 256K 128QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheets

Specifications of DF2328BVF25V

Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
87
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
128-QFP
For Use With
EDK2329 - DEV EVALUATION KIT H8S/2329
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Other names
HD64F2328BVF25V

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2328BVF25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
6.11.4
External bus release can be performed on completion of an external bus cycle. The RD signal and
the DRAM interface * RAS and CAS signals remain low until the end of the external bus cycle.
Therefore, when external bus release is performed, the RD, RAS, and CAS signals may change
from the low level to the high-impedance state.
Note: * The DRAM interface is not supported in the H8S/2321.
6.12
In a reset, the chip, including the bus controller, enters the reset state at that point, and any
executing bus cycle is discontinued.
External Bus Release Usage Note
Resets and the Bus Controller
Rev.6.00 Sep. 27, 2007 Page 215 of 1268
Section 6 Bus Controller
REJ09B0220-0600

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