DF2328BVF25V Renesas Electronics America, DF2328BVF25V Datasheet - Page 938

IC H8S MCU FLASH 256K 128QFP

DF2328BVF25V

Manufacturer Part Number
DF2328BVF25V
Description
IC H8S MCU FLASH 256K 128QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheets

Specifications of DF2328BVF25V

Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
87
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
128-QFP
For Use With
EDK2329 - DEV EVALUATION KIT H8S/2329
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Other names
HD64F2328BVF25V

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2328BVF25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 19 ROM
19.30
Precautions concerning the use of on-board programming mode, the RAM emulation function, and
PROM mode are summarized below.
Use the specified voltages and timing for programming and erasing: Applied voltages in
excess of the rating can permanently damage the device. Use a PROM programmer that supports
the Renesas microcomputer device type with 512-kbyte on-chip flash memory (FZTAT512V3A).
Do not select the HN27C4096 setting for the PROM programmer, and only use the specified
socket adapter. Failure to observe these points may result in damage to the device.
Powering on and off (see figures 19.86 to 19.88): Do not apply a high level to the FWE pin until
V
When applying or disconnecting V
the hardware protection state.
The power-on and power-off timing requirements should also be satisfied in the event of a power
failure and subsequent recovery.
FWE application/disconnection (see figures 19.86 to 19.88): FWE application should be carried
out when MCU operation is in a stable condition. If MCU operation is not stable, fix the FWE pin
low and set the protection state.
The following points must be observed concerning FWE application and disconnection to prevent
unintentional programming or erasing of flash memory:
• Apply FWE when the V
• Apply FWE when oscillation has stabilized (after the elapse of the oscillation stabilization
• In boot mode, apply and disconnect FWE during a reset.
• In user program mode, FWE can be switched between high and low level regardless of the
• Do not apply FWE if program runaway has occurred.
• Disconnect FWE only when the SWE1, ESU1, PSU1, EV1, PV1, P1, and E1 bits in FLMCR1,
Rev.6.00 Sep. 27, 2007 Page 906 of 1268
REJ09B0220-0600
CC
time).
reset state. FWE input can also be switched during execution of a program in flash memory.
and SWE2, ESU2, PSU2, EV2, PV2, P2, and E2 bits in FLMCR2 are cleared.
Make sure that the SWE1, ESU1, PSU1, EV1, PV1, P1, E1, and SWE2, ESU2, PSU2, EV2,
PV2, P2, and E2 bits are not set by mistake when applying or disconnecting FWE.
has stabilized. Also, drive the FWE pin low before turning off V
Flash Memory Programming and Erasing Precautions
CC
voltage has stabilized within its rated voltage range.
CC
power, fix the FWE pin low and place the flash memory in
CC
.

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