DF2328BVF25V Renesas Electronics America, DF2328BVF25V Datasheet - Page 767

IC H8S MCU FLASH 256K 128QFP

DF2328BVF25V

Manufacturer Part Number
DF2328BVF25V
Description
IC H8S MCU FLASH 256K 128QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheets

Specifications of DF2328BVF25V

Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
87
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
128-QFP
For Use With
EDK2329 - DEV EVALUATION KIT H8S/2329
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Other names
HD64F2328BVF25V

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2328BVF25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
19.1
The Series has 512, 384, or 256 kbytes of on-chip flash memory, or 256, 128, or 32 kbytes of on-
chip mask ROM. The ROM is connected to the bus master via a 16-bit data bus, enabling both
byte and word data to be accessed in one state. Instruction fetching is thus speeded up, and
processing speed increased.
The on-chip ROM is enabled and disabled by means of the mode pins (MD2 to MD0) and the
EAE bit in BCRL.
The flash memory version of the chip can be erased and programmed with a PROM programmer,
as well as on-board.
19.1.1
Figure 19.1 shows a block diagram of 256 kbytes of on-chip ROM.
Overview
Block Diagram
Figure 19.1 Block Diagram of ROM (256 kbytes)
H'03FFFE
H'000000
H'000002
Section 19 ROM
Internal data bus (upper 8 bits)
Internal data bus (lower 8 bits)
Rev.6.00 Sep. 27, 2007 Page 735 of 1268
H'03FFFF
H'000001
H'000003
REJ09B0220-0600
Section 19 ROM

Related parts for DF2328BVF25V