DF2328BVF25V Renesas Electronics America, DF2328BVF25V Datasheet - Page 329

IC H8S MCU FLASH 256K 128QFP

DF2328BVF25V

Manufacturer Part Number
DF2328BVF25V
Description
IC H8S MCU FLASH 256K 128QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheets

Specifications of DF2328BVF25V

Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
87
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
128-QFP
For Use With
EDK2329 - DEV EVALUATION KIT H8S/2329
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Other names
HD64F2328BVF25V

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2328BVF25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
When the DREQ pin low level is sampled while acceptance by means of the DREQ pin is
possible, the request is held in the DMAC. Then, when activation is initiated in the DMAC, the
request is cleared. After the end of the single cycle, acceptance resumes, DREQ pin low level
sampling is performed again, and this operation is repeated until the transfer ends.
7.5.12
DMAC internal-to-external dual address transfers and single address transfers can be executed at
high speed using the write data buffer function, enabling system throughput to be improved.
When the WDBE bit of BCRL in the bus controller is set to 1, enabling the write data buffer
function, dual address transfer external write cycles or single address transfers and internal
accesses (on-chip memory or internal I/O registers) are executed in parallel. Internal accesses are
independent of the bus master, and DMAC dead cycles are regarded as internal accesses.
A low level can always be output from the TEND pin if the bus cycle in which a low level is to be
output is an external bus cycle. However, a low level is not output from the TEND pin if the bus
cycle in which a low level is to be output from the TEND pin is an internal bus cycle, and an
external write cycle is executed in parallel with this cycle.
Figure 7.33 shows an example of burst mode transfer from on-chip RAM to external memory
using the write data buffer function.
Figure 7.33 Example of Dual Address Transfer Using Write Data Buffer Function
Internal read signal
External address
Internal address
Write Data Buffer Function
HWR, LWR
TEND
φ
DMA
read
DMA
write
Section 7 DMA Controller (Not Supported in the H8S/2321)
DMA
read
DMA
write
Rev.6.00 Sep. 27, 2007 Page 297 of 1268
DMA
read
DMA
write
DMA
read
DMA
write
REJ09B0220-0600
DMA
dead

Related parts for DF2328BVF25V