DF2328BVF25V Renesas Electronics America, DF2328BVF25V Datasheet - Page 332

IC H8S MCU FLASH 256K 128QFP

DF2328BVF25V

Manufacturer Part Number
DF2328BVF25V
Description
IC H8S MCU FLASH 256K 128QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheets

Specifications of DF2328BVF25V

Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
87
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
128-QFP
For Use With
EDK2329 - DEV EVALUATION KIT H8S/2329
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Other names
HD64F2328BVF25V

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2328BVF25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 7 DMA Controller (Not Supported in the H8S/2321)
7.5.14
There can be no break between a DMA cycle read and a DMA cycle write. This means that a
refresh cycle, external bus release cycle, or DTC cycle is not generated between the external read
and external write in a DMA cycle.
In the case of successive read and write cycles, such as in burst transfer or block transfer, a refresh
or external bus released state may be inserted after a write cycle. Since the DTC has a lower
priority than the DMAC, the DTC does not operate until the DMAC releases the bus.
When DMA cycle reads or writes are accesses to on-chip memory or internal I/O registers, these
DMA cycles can be executed at the same time as refresh cycles or external bus release. However,
simultaneous operation may not be possible when a write buffer is used.
Rev.6.00 Sep. 27, 2007 Page 300 of 1268
REJ09B0220-0600
Relation Between the DMAC and External Bus Requests, Refresh Cycles, and the
DTC

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