HD64F7144F50V Renesas Electronics America, HD64F7144F50V Datasheet - Page 238
HD64F7144F50V
Manufacturer Part Number
HD64F7144F50V
Description
IC SUPERH MCU FLASH 256K 112QFP
Manufacturer
Renesas Electronics America
Series
SuperH® SH7144r
Specifications of HD64F7144F50V
Core Processor
SH-2
Core Size
32-Bit
Speed
50MHz
Connectivity
EBI/EMI, I²C, SCI
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
74
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
112-QFP
For Use With
HS0005KCU11H - EMULATOR E10A-USB H8S(X),SH2(A)EDK7145 - DEV EVALUATION KIT SH7145
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
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10. Direct Memory Access Controller (DMAC)
Rev.4.00 Mar. 27, 2008 Page 192 of 882
REJ09B0108-0400
1st, 2nd bus cycles
3rd bus cycle
4th bus cycle
Figure 10.8 Dual Address Mode and Indirect Address Operation
The SAR3 value is taken as the address, memory data is read, and the value is stored in the
temporary buffer. Since the value read at this time is used as the address, it must be 32 bits.
When external connection data bus is 16 bits, two bus cycles are required.
The value in the temporary buffer is taken as the address, and data is read from the
transfer source module to the data buffer.
The DAR3 value is taken as the address, and the value in the data buffer is written to the
transfer destination module.
Note:
Memory, transfer source, and transfer destination modules are shown here. In
practice, connection can be made anywhere if there is address space.
(When External Memory Space Is 16 Bits)
Temporary
Temporary
Temporary
DMAC
DMAC
buffer
buffer
buffer
buffer
DAR3
DAR3
SAR3
SAR3
Data
Data
DMAC
buffer
buffer
DAR3
SAR3
Data
Transfer destination
Transfer destination
Transfer destination
Transfer source
Transfer source
Transfer source
Memory
Memory
Memory
module
module
module
module
module
module
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