EP2AGX190FF35C6N Altera, EP2AGX190FF35C6N Datasheet - Page 218

• Manufacturer Part Number: EP2AGX190FF35C6N
• Description: IC ARRIA II GX 190K 1152FBGA
• Manufacturer: Altera
• Series: Arria II GXr

Specifications of EP2AGX190FF35C6N

• Number Of Logic Elements/cells: 181165
• Number Of Labs/clbs: 7612
• Total Ram Bits: 9939
• Number Of I /o: 612
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C
• Package / Case: 1152-FBGA
• Family Name: Arria® II GX
• Number Of Logic Blocks/elements: 190300
• # I/os (max): 612
• Frequency (max): 400MHz
• Operating Supply Voltage (typ): 900mV
• Logic Cells: 190300
• Ram Bits: 10380902.4
• Operating Supply Voltage (min): 0.87V
• Operating Supply Voltage (max): 0.93V
• Operating Temp Range: 0C to 85C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 1152
• Package Type: FC-FBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Number Of Gates: -
• Lead Free Status / Rohs Status: Compliant

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Arria II Device Handbook Volume 1: Device Interfaces and Integration
Rules to Combine Groups
f
1
For more information about the ALTMEMPHY megafunction and UniPHY IP core,
refer to the
Use one side of the device with the ×36 mode emulation interface whenever possible,
even though the ×36 group formed by a combination of DQ/DQS groups from the top
and bottom I/O banks, or top/bottom I/O bank and left/right I/O banks is
supported.
In 572-, 780-, 1152-, and some 1517-pin package devices, there is at most one ×16/×18
group per I/O bank. You can combine two ×16/×18 groups from a single side of the
device for a ×36 interface. 358-pin package devices have only one ×16/×18 group in
each bank 4A and 7A. You can only form a ×36 interface with these two banks.
For devices that do not have four ×16/×18 groups in a single side of the device to
form two ×36 groups for read and write data, you can form one ×36 group on one side
of the device and another ×36 group on the other side of the device. Altera
recommends forming two ×36 groups on column I/O banks (top and bottom) only,
although forming a ×36 group from column I/O banks and another ×36 group from
row I/O banks for the read and write data buses is supported. For vertical migration
with the ×36 emulation implementation, you must check if migration is possible by
enabling device migration in the Quartus II project. The Quartus II software also
supports the use of four ×8/×9 DQ groups for write data pins and the migration of
these groups across device density. 358-pin package devices can only form a ×36
group for write data pin with four ×8/×9 groups.
External Memory Interface
Combining ×16/×18 DQ/DQS Groups for ×36 QDR II+/QDR II SRAM Interface
Handbook.
Chapter 7: External Memory Interfaces in Arria II Devices
December 2010 Altera Corporation