CS5535-UDCF AMD (ADVANCED MICRO DEVICES), CS5535-UDCF Datasheet - Page 79

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CS5535-UDCF

Manufacturer Part Number
CS5535-UDCF
Description
Manufacturer
AMD (ADVANCED MICRO DEVICES)
Datasheet

Specifications of CS5535-UDCF

Operating Temperature (min)
0C
Operating Temperature (max)
85C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Lead Free Status / RoHS Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
CS5535-UDCF
Manufacturer:
AMD
Quantity:
20 000
Global Concepts and Features
AMD Geode™ CS5535 Companion Device Data Book
Signal
C/BE[3:0]#
DEVSEL#
FRAME#
TRDY#
IRDY#
STOP#
PAR
REQ#
GNT#
AD[31:0]
Signal
IDE_CS[1:0]#
IDE_IOR0#
IDE_IOW0#
IDE_AD[2:0]
IDE_RESET#
IDE_RDY0
IDE_DREQ0
IDE_DACK0#
IDE_DATA[15:0]
Table 4-11. Sleep Driven PCI Signals
Table 4-12. Sleep Driven IDE Signals
Ball No.
R6, T9, U11,
U14
R11
U9
T10
R10
T11
U10
T1
R1
U1, T3, U3,
R4, T4, R5,
T5, U5, T6,
U6, R7, T7,
U7, R8, T8,
U8, R12, T12,
U12, R13,
T13, U13,
R14, T14,
P15, R15,
T15, P16, T16,
R16, T17, R17
Ball No.
C10, B10
B13
C13
B11, A12, A11
F15
A13
A14
C12
C14, B15,
B16, A17,
C17, D16,
D17, E17,
E16, E15,
D15, B17,
C16, C15,
A15, B14
Direction
Pad driven to 0. Internal
logic sees logic 1.
Pad driven to 0. Internal
logic sees logic 1.
Pad driven to 0. Internal
logic sees logic 1.
Pad driven to 0. Internal
logic sees logic 1.
Pad driven to 0. Internal
logic sees logic 1.
Pad driven to 0. Internal
logic sees logic 1.
Pad driven to 0. Internal
logic sees logic 1.
Pad driven to 0.
Pad TRI-STATE. Internal
logic sees logic 0.
Pad driven to 0.
Direction
Pad driven to 0.
Pad driven to 0.
Pad driven to 0.
Pad driven to 0.
Pad driven to 0.
Pad TRI-STATE. Internal
logic sees logic 0.
Pad TRI-STATE. Internal
logic sees logic 0.
Pad driven to 0.
Pad driven to 0.
4.9
Typically the three greatest power consumers in a comput-
ing device are the display, the hard drive (if it has one) and
the system electronics. The CPU usually consumes the
most power of all the system electronic components. Man-
aging power for the first two is relatively straightforward in
the sense that they are simply turned on or off. Managing
CPU power is more difficult since effective use clock con-
trol technology requires effective detection of inactivity,
both at a system level and at a code processing level.
Power consumption in a Geode GX processor or other
Geode processor based system is managed with the use
of both hardware and software. The complete hardware
solution is provided for only when the Geode GX processor
is combined with the Geode CS5535 companion device.
The processor power consumption is managed primarily
through a sophisticated clock stop management technol-
ogy. The processor also provides the hardware enablers
from which the complete power management solution
depends on.
Basically two methods are supported to manage power
during periods of inactivity. The first method, called activity
based power management allows the hardware in the
Geode CS5535 companion device to monitor activity to
certain devices in the system and if a period of inactivity
occurs take some form of power conservation action. This
method does not require OS support because this support
is handled by SMM software. Simple monitoring of external
activity is imperfect as well as inefficient. The second
method, called passive power management, requires the
OS to take an active role in managing power. AMD sup-
ports two application programming interfaces (APIs) to
enable power management by the OS: Advanced Power
Management (APM) and Advanced Configuration and
Power Interface (ACPI). These two methods can be used
independent of one another or they can be used together.
The extent to which these resources are employed
depends on the application and the discretion of the sys-
tem designer.
The Geode GX processor and Geode CS5535 companion
device contain advanced power management features for
reducing the power consumption of the processor, com-
panion device and other devices in the system.
Power Management
31506B
79

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