CS5535-UDCF AMD (ADVANCED MICRO DEVICES), CS5535-UDCF Datasheet - Page 575

• Manufacturer Part Number: CS5535-UDCF
• Manufacturer: AMD (ADVANCED MICRO DEVICES)

Specifications of CS5535-UDCF

• Operating Temperature (min): 0C
• Operating Temperature (max): 85C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Compliant

Package Specifications
AMD Geode™ C5535 companion device is packaged in a 208-terminal PBGA (plastic ball grid array). Figure 8-1 provides
the mechanical dimensions of the package.
NOTES: UNLESS OTHERWISE SPECIFIED.
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AMD Geode™ CS5535 Companion Device Data Book
PBGA WITH LEAD (PB):
a) SOLDER BALL COMPOSITION: SN 63%, PB 37%.
b) SOLDERING PROFILE: 220o C.
PBGA LEAD (PB) FREE:
a) SOLDER BALL COMPOSITION: SN 96.5%, AG 3.5%.
b) SOLDERING PROFILE: 260o C
DIMENSION IS MEASURED AT THE MAXIMUM SOLDER BALL DIAMETER, PARALLEL TO PRIMARY DATUM N.
THE MOLD SURFACE AREA MAY INCLUDE DIMPLE FOR A1 BALL CORNER IDENTIFICATION.
REFERENCE JEDEC REGISTRATION MO-151, VARIATION BAJ-2.
Figure 8-1. 208-Terminal PBGA Package (Body Size: 23x23x2.13 mm; Pitch: 1.27 mm)
8.0Package Specifications
31506B
8
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