DF2317VTE25 Renesas Electronics America, DF2317VTE25 Datasheet - Page 847

• Manufacturer Part Number: DF2317VTE25
• Description: MCU 3V 128K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2300r

Specifications of DF2317VTE25

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: POR, PWM, WDT
• Number Of I /o: 79
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Other names: HD64F2317VTE25; HD64F2317VTE25

Software standby mode is then cleared at the rising edge on the NMI pin.
19.6.5
I/O Port Status: In software standby mode, I/O port states are retained. If the OPE bit is set to 1,
the address bus and bus control signal output is also retained. Therefore, there is no reduction in
current dissipation for the output current when a high-level signal is output.
Current Dissipation during Oscillation Stabilization Wait Period: Current dissipation
increases during the oscillation stabilization wait period.
Oscillator
φ
NMI
NMIEG
SSBY
Usage Notes
Figure 19.2 Software Standby Mode Application Example
NMI exception
handling
NMIEG=1
SSBY=1
SLEEP instruction
Software standby mode
(power-down mode)
Rev.7.00 Feb. 14, 2007 page 813 of 1108
stabilization
Oscillation
time t
Section 19 Power-Down Modes
OSC2
NMI exception
REJ09B0089-0700
handling