DF2317VTE25 Renesas Electronics America, DF2317VTE25 Datasheet - Page 438

MCU 3V 128K 100-TQFP

DF2317VTE25

Manufacturer Part Number
DF2317VTE25
Description
MCU 3V 128K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheet

Specifications of DF2317VTE25

Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
79
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Other names
HD64F2317VTE25
HD64F2317VTE25

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Section 10 8-Bit Timers
10.3.3
TCNT is cleared at the rising edge of an external reset input, depending on the settings of the
CCLR1 and CCLR0 bits in TCR. The clear pulse width must be at least 1.5 states. Figure 10.7
shows the timing of this operation.
10.3.4
The OVF in TCSR is set to 1 when TCNT overflows (changes from H'FF to H'00). Figure 10.8
shows the timing of this operation.
Rev.7.00 Feb. 14, 2007 page 404 of 1108
REJ09B0089-0700
φ
External reset
input pin
Clear signal
TCNT
Timing of TCNT External Reset
Timing of Overflow Flag (OVF) Setting
φ
TCNT
Overflow signal
OVF
Figure 10.7 Timing of Clearance by External Reset
Figure 10.8 Timing of OVF Setting
N−1
H'FF
N
H'00
H'00

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