DF2317VTE25 Renesas Electronics America, DF2317VTE25 Datasheet - Page 530

MCU 3V 128K 100-TQFP

DF2317VTE25

Manufacturer Part Number
DF2317VTE25
Description
MCU 3V 128K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheet

Specifications of DF2317VTE25

Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
79
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Other names
HD64F2317VTE25
HD64F2317VTE25

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Section 12 Serial Communication Interface (SCI)
Rev.7.00 Feb. 14, 2007 page 496 of 1108
REJ09B0089-0700
TE bit
TE bit
SCK output pin
TxD output pin
SCK output pin
TxD output pin
Note: * Initialized by software standby.
Port input/output
Port input/output
Figure 12.24 Asynchronous Transmission Using Internal Clock
Figure 12.25 Synchronous Transmission Using Internal Clock
Port
Port
Marking output
High output
Start of transmission
Start of transmission
Start
SCI TxD output
SCI TxD output
transmission
End of
transmission
Last TxD bit held
End of
Stop
to software
Transition
to software
standby
Transition
standby
Port input/output
Port input/output
Port input/output
Port input/output
Port
Port
Exit from
software
standby
Exit from
software
standby
High output*
High output
SCI TxD
SCI TxD
output
output

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