DF2317VTE25 Renesas Electronics America, DF2317VTE25 Datasheet - Page 1054

• Manufacturer Part Number: DF2317VTE25
• Description: MCU 3V 128K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2300r

Specifications of DF2317VTE25

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: POR, PWM, WDT
• Number Of I /o: 79
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Other names: HD64F2317VTE25; HD64F2317VTE25

Appendix B Internal I/O Registers
RDR0—Receive Data Register 0
SCMR0—Smart Card Mode Register 0
Bit
Initial value
Read/Write
Rev.7.00 Feb. 14, 2007 page 1020 of 1108
REJ09B0089-0700
Bit
Initial value
Read/Write
:
:
:
:
:
:
⎯
⎯
7
1
R
7
0
⎯
⎯
6
1
R
6
0
⎯
⎯
5
1
Smart Card Data Direction
R
5
0
0
1
⎯
⎯
4
1
Stores received serial data
TDR contents are transmitted LSB-first
Receive data is stored in RDR LSB-first
TDR contents are transmitted MSB-first
Receive data is stored in RDR MSB-first
SDIR
R/W
3
0
R
H'FF7D
H'FF7E
4
0
Smart Card Data Invert
0
1
SINV
R/W
2
0
TDR contents are transmitted as they are
Receive data is stored in RDR as it is
TDR contents are inverted before
being transmitted
Receive data is stored in RDR
in inverted form
R
3
0
Smart Card
Interface Mode Select
0
1
Smart card interface
function is disabled
Smart card interface
function is enabled
SCI0, Smart Card Interface 0
SCI0, Smart Card Interface 0
⎯
⎯
1
1
R
2
0
SMIF
R/W
0
0
R
1
0
R
0
0