DF2317VTE25 Renesas Electronics America, DF2317VTE25 Datasheet - Page 709

MCU 3V 128K 100-TQFP

DF2317VTE25

Manufacturer Part Number
DF2317VTE25
Description
MCU 3V 128K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheet

Specifications of DF2317VTE25

Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
79
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Other names
HD64F2317VTE25
HD64F2317VTE25

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2317VTE25V
Manufacturer:
AD
Quantity:
3 643
Part Number:
DF2317VTE25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Table 17.38 AC Characteristics when Entering Another Mode from Memory Read Mode
Conditions: V
Item
Command write cycle
CE hold time
CE setup time
Data hold time
Data setup time
Write pulse width
WE rise time
WE fall time
Figure 17.53 Timing Waveforms when Entering Another Mode from Memory Read Mode
I/O
Note: Do not enable WE and OE at the same time.
A
7
18
to I/O
to A
WE
OE
CE
0
0
CC
= 3.3 V ±0.3 V, V
Memory read mode
Address stable
Symbol
t
t
t
t
t
t
t
t
nxtc
ceh
ces
dh
ds
wep
r
f
SS
= 0 V, T
a
= 25°C ±5°C
Min
20
0
0
50
50
70
t
Rev.7.00 Feb. 14, 2007 page 675 of 1108
nxtc
Other mode command write
Max
30
30
t
ces
t
f
t
wep
t
ds
REJ09B0089-0700
Unit
μs
ns
ns
ns
ns
ns
ns
ns
Section 17 ROM
t
ceh
t
r
t
dh

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